Texas Instruments_66AK2L06XCMSA2
original

Texas Instruments
66AK2L06XCMSA2

698-66AK2L06XCMSA2
PDF Datasheet
Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 900-FCBGA 0 to 0
20 Weeks

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Tech Specifications

Max Operating Temperature
100
Number of Terminals
900
Min Operating Temperature
-40
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B900
Width
25
Length
25
Pin Count
900
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66AK2L06XCMSA2 Description

66AK2L06XCMSA2 Description

The 66AK2L06XCMSA2 from Texas Instruments is a high-performance DSP+ARM® System-on-Chip (SoC) from the 66AK2Lx KeyStone Multicore series, designed for demanding embedded processing applications. This 900-FCBGA packaged device integrates a 1.2GHz DSP and ARM core, delivering exceptional computational power for real-time signal processing and control tasks. With 5.384MB of on-chip RAM and 384kB of ROM, it offers ample memory for high-speed data handling and firmware storage. The SoC supports a variable core voltage and flexible I/O voltages (0.85V, 1.0V, 1.8V, 3.3V), enabling optimized power efficiency across diverse operating conditions.

66AK2L06XCMSA2 Features

  • Multicore Architecture: Combines DSP and ARM cores for hybrid processing, ideal for both real-time signal processing and application control.
  • High-Speed Interfaces: Includes Ethernet, PCIe, USB 3.0, I2C, SPI, UART/USART, and USIM, ensuring seamless connectivity in complex systems.
  • Large On-Chip Memory: 5.384MB RAM reduces latency for data-intensive tasks, while 384kB ROM provides secure boot capabilities.
  • Power Efficiency: Supports dynamic voltage scaling for core and I/O, minimizing power consumption in portable or battery-operated devices.
  • Robust Packaging: Surface-mount 900-FCBGA with MSL 4 (72 hours) moisture sensitivity, suitable for industrial and automotive environments.
  • Compliance: ROHS3 and REACH compliant, meeting global environmental and safety standards.

66AK2L06XCMSA2 Applications

This SoC excels in applications requiring high-throughput processing and low-latency communication, such as:

  • Wireless Base Stations: Leveraging its DSP capabilities for real-time signal modulation and ARM for protocol stack management.
  • Medical Imaging Systems: High-speed data processing for ultrasound or MRI systems.
  • Industrial Automation: Control and monitoring in robotics, PLCs, and motor drives.
  • Automotive ADAS: Sensor fusion and vision processing for advanced driver-assistance systems.
  • Communications Infrastructure: Packet processing in routers, switches, and network appliances.

Conclusion of 66AK2L06XCMSA2

The 66AK2L06XCMSA2 stands out as a versatile, high-performance SoC, combining DSP and ARM processing with extensive memory and connectivity options. Its power efficiency, multicore architecture, and industrial-grade reliability make it a superior choice for developers in telecommunications, automotive, and industrial sectors. Texas Instruments' robust design ensures compliance with stringent environmental and performance standards, making it a future-proof solution for next-generation embedded systems.

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