Texas Instruments_DS250DF810ABVR

Texas Instruments
DS250DF810ABVR  
Specialized Backplane Connectors

Texas Instruments
DS250DF810ABVR
407-DS250DF810ABVR
Ersa
Texas Instruments-DS250DF810ABVR-datasheets-2526046.pdf
IC INTFACE SPECIALIZED 135FCBGA
In Stock : 2

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DS250DF810ABVR Description

DS250DF810ABVR Description

The DS250DF810ABVR is a specialized backplane connector IC designed and manufactured by Texas Instruments. This advanced component is engineered to meet the demanding requirements of high-speed data transmission in complex electronic systems. With its 135-FCBGA package, the DS250DF810ABVR offers a compact and efficient solution for retimer applications, ensuring reliable performance in a wide range of environments.

DS250DF810ABVR Features

  • High-Speed Data Transmission: The DS250DF810ABVR is designed for retimer applications, enabling high-speed data transmission between various electronic components.
  • Surface Mount Technology: This IC utilizes surface mount technology, which allows for a more compact and efficient design, reducing the overall size and weight of the system.
  • RoHS Compliance: The DS250DF810ABVR is compliant with the RoHS3 directive, ensuring that it meets strict environmental and safety standards.
  • Moisture Sensitivity Level (MSL) 3: With an MSL of 3, the DS250DF810ABVR can withstand up to 168 hours of exposure to moisture, making it suitable for use in a variety of environments.
  • Tape & Reel (TR) Packaging: This packaging option allows for easy handling and automated placement, streamlining the manufacturing process.

DS250DF810ABVR Applications

The DS250DF810ABVR is ideal for use in a variety of applications where high-speed data transmission and reliable performance are critical. Some specific use cases include:

  • Telecommunications Systems: The DS250DF810ABVR can be used in telecommunications systems to ensure fast and reliable data transmission between various components.
  • High-Speed Networking Equipment: This IC is well-suited for use in high-speed networking equipment, such as routers and switches, where data integrity and speed are paramount.
  • Industrial Automation Systems: The DS250DF810ABVR can be utilized in industrial automation systems to facilitate efficient communication between control units and various sensors and actuators.

Conclusion of DS250DF810ABVR

The DS250DF810ABVR from Texas Instruments is a high-performance, specialized backplane connector IC that offers numerous advantages over similar models. Its compact design, high-speed data transmission capabilities, and RoHS compliance make it an ideal choice for a wide range of applications. With its unique features and advantages, the DS250DF810ABVR is poised to deliver exceptional performance and reliability in the most demanding electronic systems.

Tech Specifications

Category
PCB changed
HTS
ECCN (US)
PPAP
Product Status
Supplier Device Package
Automotive
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Supplier Package
Package / Case
Voltage - Supply
REACH Status
Mfr
Maximum Operating Supply Voltage (V)
EU RoHS
RoHS Status
Moisture Sensitivity Level (MSL)
Applications
ECCN
Package Length
Mounting Type
Standard Package Name
Maximum Supply Current (mA)
Pin Count
Mounting
Series
Lead Shape
Part Status
Typical Operating Supply Voltage (V)
HTSUS
Package
Package Width
Interface
Base Product Number
Minimum Operating Supply Voltage (V)
Mounting Style
Moisture Sensitive
Maximum Operating Temperature
USHTS
Application
RoHS
Minimum Operating Temperature

DS250DF810ABVR Documents

Download datasheets and manufacturer documentation for DS250DF810ABVR

Ersa Wafer Fab Site 01/Oct/2020      
Ersa Advanced Signal Conditioning       DS250DF810 Datasheet      
Ersa Advanced Signal Conditioning       DS250DF810 Datasheet      
Ersa DS250DF810 20/Aug/2019       DS250DFx 09/Sep/2019      

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