Texas Instruments

INA168NA/250

INA168NA/250 Description

The INA168NA/250 from Texas Instruments is a high-precision current monitor IC designed for surface-mount applications. It offers ±0.5% accuracy across a wide input voltage range of 2.7V to 60V, making it ideal for demanding power monitoring tasks. Packaged in a compact SOT23-5 form factor and supplied in Tape & Reel (TR), it is optimized for automated assembly processes. The device complies with ROHS3 and REACH environmental standards, ensuring suitability for modern electronics manufacturing. With a Moisture Sensitivity Level (MSL) of 2 (1 Year), it balances reliability with ease of handling in production environments.

INA168NA/250 Features

• High Accuracy: ±0.5% error ensures precise current measurement in critical applications.
• Wide Input Range: Operates from 2.7V to 60V, accommodating diverse power systems.
• Compact Design: SOT23-5 package saves board space while enabling high-density layouts.
• Robust Compliance: ROHS3 and REACH Unaffected status meets stringent environmental regulations.
• Automation-Friendly: Tape & Reel (TR) packaging streamlines high-volume production.
• Low Sensitivity: MSL 2 (1 Year) rating reduces handling constraints compared to higher MSL components.

INA168NA/250 Applications

• Battery Management Systems (BMS): Monitors charge/discharge currents with high accuracy.
• Industrial Power Supplies: Provides reliable current feedback in 48V or lower voltage systems.
• Automotive Electronics: Suitable for 12V/24V rail monitoring due to its wide input range.
• Solar Inverters: Tracks DC-link currents in renewable energy systems.
• Telecom Infrastructure: Ensures precise current sensing in base stations and power distribution units.

Conclusion of INA168NA/250

The INA168NA/250 stands out for its precision, wide voltage range, and compact design, making it a versatile choice for current monitoring in industrial, automotive, and renewable energy applications. Its compliance with ROHS3 and REACH, combined with automation-ready packaging, positions it as a reliable solution for modern electronics. Engineers will appreciate its balance of performance and manufacturability, particularly in space-constrained or high-reliability systems.