Texas Instruments

LM63DIMA/NOPB  

Thermal Management ICs

LM63DIMA/NOPB Description

The LM63DIMA/NOPB is a highly integrated thermal management IC designed by Texas Instruments, offering comprehensive temperature monitoring and fan control functionalities. This device is housed in an 8-SOIC package, making it suitable for surface mount applications. It operates within a temperature range of 0°C to 85°C and can sense temperatures from 0°C to 125°C, providing accurate temperature readings with a ±3°C accuracy. The LM63DIMA/NOPB features an internal and external sensor type, allowing for versatile temperature monitoring applications.

The device is powered by a supply voltage ranging from 3V to 3.6V and includes an ADC (Sigma Delta) topology, comparator, fan speed control, and register bank. It supports output fan control and alarm functionalities, making it ideal for applications requiring precise temperature management and fan control. The LM63DIMA/NOPB is compliant with REACH and ROHS3 standards, ensuring environmental safety and regulatory compliance. It also has a moisture sensitivity level (MSL) of 1, indicating it is unaffected by moisture, making it suitable for a wide range of operating environments.

LM63DIMA/NOPB Features

• Temperature Monitoring: The LM63DIMA/NOPB provides accurate temperature sensing with a ±3°C accuracy over a wide range of 0°C to 125°C, making it suitable for various thermal management applications.
• Fan Control: Integrated fan speed control allows for dynamic adjustment of fan speeds based on temperature readings, ensuring optimal cooling and energy efficiency.
• Alarm Functionality: The device includes an output alarm feature, which can be configured to trigger alerts based on predefined temperature thresholds, enhancing system reliability and safety.
• Flexibility: With both internal and external sensor types, the LM63DIMA/NOPB offers flexibility in temperature monitoring, allowing for precise control in diverse environments.
• Environmental Compliance: The LM63DIMA/NOPB is REACH unaffected and ROHS3 compliant, ensuring it meets the highest environmental standards and regulatory requirements.
• Moisture Resistance: With an MSL rating of 1, the device is suitable for applications in environments with varying humidity levels, ensuring long-term reliability and performance.

LM63DIMA/NOPB Applications

The LM63DIMA/NOPB is ideal for a variety of applications where precise temperature control and fan management are critical. Some specific use cases include:

• Telecommunications Equipment: Ensuring optimal operating temperatures in routers, switches, and other networking devices to prevent overheating and system failures.
• Computing Systems: Managing thermal conditions in servers, workstations, and personal computers to maintain performance and extend hardware lifespan.
• Industrial Control Systems: Providing reliable temperature monitoring and control in industrial environments where equipment operates under varying thermal conditions.
• Consumer Electronics: Enhancing the thermal management of devices such as gaming consoles, smart TVs, and high-performance audio systems to ensure stable operation and user satisfaction.

Conclusion of LM63DIMA/NOPB

The LM63DIMA/NOPB from Texas Instruments is a versatile and reliable thermal management IC that offers comprehensive temperature monitoring and fan control capabilities. Its wide operating and sensing temperature ranges, coupled with accurate temperature sensing and flexible fan control, make it an ideal solution for a variety of applications. The device's compliance with environmental standards and its moisture resistance further enhance its suitability for diverse operating conditions. For applications requiring precise temperature management and reliable fan control, the LM63DIMA/NOPB stands out as a robust and efficient choice.

LM63DIMA/NOPB Documents

Download datasheets and manufacturer documentation for LM63DIMA/NOPB

EOL :

Product Discontinuance Notification (PDF)      

Images :

Mechanical Outline Drawing       Function Diagram      

PCN :

Qualification of copper wire as alternate bonding material for selected products in SOIC Package (PDF)       Qualification of SID# 101380756 Mold Compound for Select SOIC Device(s) (PDF)      

Models :

LM63DIMA/NOPB Symbol & Footprint by SnapMagic