Texas Instruments

LM63DIMAX  

Thermal Management ICs

This electronic device regards Tape & Reel (TR) method as the top priority. This LM63DIMAX packaging method makes it simple and quick to package big quantities of powdered commodities. This LM63DIMAX is produced by this Texas Instruments in order to provide enough products to meet consumers’ demand. The blueprint of this Texas Instruments is to keep pace with the growth of world’s leading level of science and technology. This LM63DIMAX belongs to Thermal Management ICs category. It’s previous category pertains to Power Management (PMIC). Complete power supply systems can be implemented using Power Management Integrated Circuits (PMICs). It combines several voltage regulators and control circuits onto a single chip. They simplify and cost-effectively manage system power management while reducing component count and board area. This LM63DIMAX is a great fit for embedded processing in a variety of applications. They are includes edge computing, the Internet of Things (IoT), industrial and medical IoT, electric vehicles (EVs), and autonomous cars.

LM63DIMAX Documents

Download datasheets and manufacturer documentation for LM63DIMAX

Datasheets :

LM63      

HTML Datasheet :

LM63      

PCN Design/Specification :

SOIC Pkg Wire Bonding Update 24/Jul/2013