Texas Instruments_OMAPL137DZKB3
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Texas Instruments
OMAPL137DZKB3

694-OMAPL137DZKB3
PDF Datasheet
DSP+ARM Processor, 456MHz, 128KB RAM, SPI, USB, 0-90°C, BGA
6 Weeks

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Tech Specifications

Package/Case
BGA
Core Architecture
ARM
Data Bus Width
16b
Interface
SPI, USB
Lead Free
Lead Free
Max Frequency
456MHz
Max Operating Temperature
90°C
Memory Size
32KB
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OMAPL137DZKB3 Description

The Texas Instruments' OMAP-L137DZKB3 is a high-performance, low-power system-on-chip (SoC) designed for a wide range of applications, including industrial, automotive, and consumer electronics. This SoC combines powerful processing capabilities with advanced connectivity options, making it an ideal choice for demanding applications.

Description:

The OMAP-L137DZKB3 is a member of the Texas Instruments' OMAP-L1x family of SoCs. It is built on a 28nm process technology and features an ARM Cortex-A15 core running at up to 1.0 GHz, along with an ARM Cortex-M4 co-processor. The SoC also includes a PowerVR SGX544 GPU, providing advanced graphics and video processing capabilities.

Features:

  1. ARM Cortex-A15 core: The OMAP-L137DZKB3 features a high-performance ARM Cortex-A15 core, which delivers outstanding processing power for demanding applications.
  2. ARM Cortex-M4 co-processor: The SoC includes an ARM Cortex-M4 co-processor, which is ideal for handling low-power, real-time tasks.
  3. PowerVR SGX544 GPU: The integrated PowerVR SGX544 GPU provides advanced graphics and video processing capabilities, making the SoC suitable for applications that require high-quality visuals.
  4. Connectivity options: The OMAP-L137DZKB3 offers a range of connectivity options, including Gigabit Ethernet, USB, and UART, ensuring seamless integration with various peripherals and networks.
  5. Memory support: The SoC supports a wide range of memory types, including DDR3, DDR3L, and LPDDR2, allowing for flexible memory configurations to meet the needs of different applications.
  6. Security features: The OMAP-L137DZKB3 includes advanced security features, such as secure boot, secure storage, and secure communication, ensuring the protection of sensitive data and applications.

Applications:

  1. Industrial automation: The OMAP-L137DZKB3 is well-suited for industrial automation applications, where high processing power, advanced connectivity, and real-time performance are required.
  2. Automotive infotainment: The SoC's powerful processing capabilities and advanced graphics make it an ideal choice for automotive infotainment systems, providing high-quality visuals and seamless connectivity.
  3. Consumer electronics: The OMAP-L137DZKB3 can be used in a variety of consumer electronics, such as smart home devices, wearables, and portable media players, offering high performance and advanced connectivity options.
  4. Medical devices: The SoC's low-power capabilities and real-time performance make it suitable for medical devices, such as monitoring systems and diagnostic equipment.
  5. Networking and communication: The OMAP-L137DZKB3 can be used in networking and communication devices, such as routers, switches, and gateways, providing high-speed processing and advanced connectivity options.

In summary, the Texas Instruments' OMAP-L137DZKB3 is a versatile, high-performance SoC that offers a range of features and applications, making it an excellent choice for a variety of demanding applications across different industries.

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The standard lead time for OMAPL137DZKB3 is 6 Weeks.
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Availability (In Stock : 22 )
Quantity Unit Price Ext. Price
1+ $29.44800 $29.45
30+ $27.89828 $836.95
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