Texas Instruments_SN74ALVC244IPWREP

Texas Instruments
SN74ALVC244IPWREP  
Buffers, Drivers, Receivers, Transceivers

Texas Instruments
SN74ALVC244IPWREP
704-SN74ALVC244IPWREP
Ersa
Texas Instruments-SN74ALVC244IPWREP-datasheets-2299803.pdf
IC BUF NON-INVERT 3.6V 20TSSOP
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SN74ALVC244IPWREP Description

SN74ALVC244IPWREP Description

The SN74ALVC244IPWREP is a high-performance, non-inverting buffer Logic IC Chip manufactured by Texas Instruments. This device is part of the 74ALVC series, known for its robustness and reliability in various electronic applications. The SN74ALVC244IPWREP features a 20-TSSOP package and is designed to operate within a supply voltage range of 1.65V to 3.6V, making it suitable for a wide range of power supply configurations. It comprises two elements, each with four bits, providing flexibility in handling multiple data lines. The device is RoHS3 compliant and REACH unaffected, ensuring it meets the highest environmental and safety standards. With a moisture sensitivity level (MSL) of 1 (unlimited), it is highly resistant to moisture, making it ideal for various environmental conditions. The SN74ALVC244IPWREP is available in a tape and reel (TR) package, facilitating efficient manufacturing and assembly processes.

SN74ALVC244IPWREP Features

  • High Output Current Capability: The SN74ALVC244IPWREP offers an output current of 24mA for both high and low states, ensuring robust performance and the ability to drive multiple loads effectively.
  • Wide Operating Voltage Range: The device operates within a voltage range of 1.65V to 3.6V, providing flexibility and compatibility with various power supply systems.
  • Non-Inverting Buffer Functionality: This feature ensures that the output signal maintains the same logical state as the input signal, simplifying circuit design and reducing complexity.
  • Surface Mount Technology (SMT): The surface mount mounting type allows for compact and efficient PCB designs, reducing the overall footprint and enhancing thermal performance.
  • Environmental Compliance: The SN74ALVC244IPWREP is RoHS3 compliant and REACH unaffected, ensuring it meets stringent environmental regulations and is safe for use in various applications.
  • Moisture Resistance: With an MSL of 1 (unlimited), the device is highly resistant to moisture, making it suitable for use in humid or challenging environments.
  • Packaging: Available in a tape and reel (TR) package, the SN74ALVC244IPWREP is ideal for automated assembly processes, enhancing manufacturing efficiency and reducing costs.

SN74ALVC244IPWREP Applications

The SN74ALVC244IPWREP is ideal for a variety of applications where high performance, reliability, and environmental compliance are critical. Key applications include:

  • Data Buffering: The non-inverting buffer functionality makes it suitable for buffering data lines in communication systems, ensuring signal integrity and reducing noise.
  • Signal Distribution: The device can distribute a single input signal to multiple output lines, simplifying circuit design and improving signal management.
  • Digital Systems: The wide operating voltage range and high output current capability make it ideal for use in digital systems, such as microcontrollers, FPGAs, and other digital circuits.
  • Consumer Electronics: The compact size and surface mount technology enable integration into consumer electronics, such as smartphones, tablets, and other portable devices.
  • Industrial Automation: The robustness and environmental compliance make it suitable for industrial applications, including automation systems, control panels, and monitoring devices.

Conclusion of SN74ALVC244IPWREP

The SN74ALVC244IPWREP is a versatile and reliable Logic IC Chip that offers a range of technical specifications and performance benefits. Its wide operating voltage range, high output current capability, and non-inverting buffer functionality make it suitable for various applications, from data buffering to signal distribution. The device's environmental compliance and moisture resistance further enhance its reliability and suitability for use in diverse environments. With its compact surface mount package and compatibility with automated assembly processes, the SN74ALVC244IPWREP is an excellent choice for engineers and designers looking for a high-performance, reliable, and environmentally friendly solution.

Tech Specifications

Number of Channels per Chip
Number of Output Enables per Chip
Maximum Propagation Delay Time @ Maximum CL (ns)
Maximum Quiescent Current (uA)
PPAP
Product Status
Automotive
Supplier Package
Maximum High Level Output Current (mA)
Package / Case
Absolute Propagation Delay Time (ns)
Voltage - Supply
Logic Function
REACH Status
Maximum Operating Supply Voltage (V)
Number of Elements
EU RoHS
Moisture Sensitivity Level (MSL)
Operating Temperature
Logic Type
ECCN
Mounting Type
Standard Package Name
Pin Count
Mounting
Input Signal Type
Lead Shape
SVHC
Typical Operating Supply Voltage (V)
HTSUS
Package
Current - Output High, Low
PCB changed
Output Type
HTS
Number of Elements per Chip
ECCN (US)
Supplier Device Package
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Process Technology
Propagation Delay Test Condition (pF)
Package Height
Mfr
Polarity
RoHS Status
Input Type
Number of Bits per Element
Number of Inputs per Chip
Number of Outputs per Chip
Package Length
Maximum Low Level Output Current (mA)
Series
Number of Input Enables per Chip
Bus Hold
Part Status
Logic Family
Package Width
Base Product Number
Minimum Operating Supply Voltage (V)
Unit Weight
Supply Current - Max
RoHS
Supply Voltage - Min
Function
Operating Supply Current
Number of Channels
Technology
Height
Maximum Operating Temperature
Supply Voltage - Max
Width
Mounting Style
Number of Input Lines
Minimum Operating Temperature
High Level Output Current
Number of Output Lines
Length
Operating Supply Voltage
Quiescent Current
Low Level Output Current
USHTS
Propagation Delay Time

SN74ALVC244IPWREP Documents

Download datasheets and manufacturer documentation for SN74ALVC244IPWREP

Ersa Mechanical Outline Drawing      
Ersa Qualification of Mold Compound 4211471 and Mount Compound 4211470 for Select Devices Assembled in TI-Malaysia and TI-Taiwan using TSSOP package (PDF)      
Ersa SN74ALVC244IPWREP Symbol & Footprint by SnapMagic      
Ersa Logic Guide (Rev. AB)      

Shopping Guide

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