Texas Instruments_TMS320C6713BZDP300

Texas Instruments
TMS320C6713BZDP300  
DSP

Texas Instruments
TMS320C6713BZDP300
698-TMS320C6713BZDP300
Ersa
Texas Instruments-TMS320C6713BZDP300-datasheets-3835784.pdf
IC DSP FLOATING-POINT 272-BGA
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TMS320C6713BZDP300 Description

The Texas Instruments TMS320C6713BZDP300 is a high-performance digital signal processor (DSP) designed for a wide range of applications, including audio, video, and communications systems. Here is a brief description of the model, its features, and potential applications:

Description:

The TMS320C6713BZDP300 is a member of the TMS320C6000™ DSP family, which is known for its high performance and low power consumption. This specific model is a high-density, plastic ball grid array (BGA) package that offers a combination of high processing power, memory, and I/O capabilities.

Features:

  1. Core: It features a high-performance floating-point unit (FPU) and a fixed-point unit (FPU) that can operate simultaneously, providing efficient and flexible processing capabilities.
  2. Memory: The device includes a large on-chip memory, including 8KB of level 1 (L1) program and data caches, and up to 32MB of external memory.
  3. I/O: The TMS320C6713BZDP300 offers a variety of I/O interfaces, such as multi-channel buffered serial ports (McBSP), universal asynchronous/synchronous receiver-transmitters (UARTs), and general-purpose timers.
  4. Peripherals: The device includes a range of peripherals, such as a host port interface (HPI), external memory controller (EMIF), and a high-speed external bus interface (EMIF).
  5. Power Management: The DSP features advanced power management capabilities, allowing for low power consumption and extended battery life in portable applications.
  6. Debug and Emulation: The TMS320C6713BZDP300 includes JTAG and EMIF interfaces for debugging and emulation purposes.

Applications:

The TMS320C6713BZDP300 is suitable for a wide range of applications that require high processing power, low power consumption, and advanced signal processing capabilities. Some potential applications include:

  1. Audio and Video Processing: The device can be used for audio and video encoding/decoding, filtering, and other signal processing tasks in multimedia systems.
  2. Communications Systems: The DSP can be employed in wireless and wired communication systems for tasks such as channel equalization, error correction, and modulation/demodulation.
  3. Medical Imaging: The TMS320C6713BZDP300 can be used for image processing and analysis in medical imaging devices, such as ultrasound machines and CT scanners.
  4. Industrial Automation: The DSP can be utilized for control and signal processing tasks in industrial automation systems, such as motor control and sensor data processing.
  5. Automotive Applications: The device can be used for advanced driver assistance systems (ADAS), infotainment systems, and other automotive electronics applications.

In summary, the Texas Instruments TMS320C6713BZDP300 is a high-performance digital signal processor with a wide range of features and applications. Its combination of processing power, memory, and I/O capabilities make it suitable for various high-end applications, including audio, video, communications, medical imaging, industrial automation, and automotive systems.

Tech Specifications

Program Memory Type
PPAP
Data Bus Width (bit)
Product Status
SPI
Automotive
Supplier Package
Maximum Low Level Output Voltage (V)
Package / Case
Instruction Set Architecture
Core Architecture
REACH Status
Family Name
Maximum Operating Supply Voltage (V)
EU RoHS
Moisture Sensitivity Level (MSL)
Operating Temperature
ECCN
Supplier Temperature Grade
Mounting Type
Numeric and Arithmetic Format
Standard Package Name
Pin Count
Mounting
Clock Rate
CAN
USART
Lead Shape
Ethernet
SVHC
Typical Operating Supply Voltage (V)
HTSUS
Package
Programmability
Non-Volatile Memory
PCB changed
HTS
ECCN (US)
Minimum High Level Output Voltage (V)
Device Core
Supplier Device Package
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Package Height
Mfr
I2C
Interface Type
RoHS Status
On-Chip RAM
USB
RAM Size
UART
I2S
Package Length
Device Million Instructions per Second (MIPS)
Series
Type
Device Input Clock Speed (MHz)
Voltage - Core
Part Status
Voltage - I/O
Package Width
Interface
Base Product Number
Minimum Operating Supply Voltage (V)
Unit Weight
Product
L1 Cache Instruction Memory
RoHS
Tradename
Maximum Clock Frequency
Maximum Operating Temperature
Data RAM Size
Core
Mounting Style
Data Bus Width
Minimum Operating Temperature
L1 Cache Data Memory
Moisture Sensitive
Instruction Type
Operating Supply Voltage
Number of I/Os
Program Memory Size
USHTS
Number of Cores

TMS320C6713BZDP300 Documents

Download datasheets and manufacturer documentation for TMS320C6713BZDP300

Ersa Qualification Assembly Site 11/Sep/2014      
Ersa TMS320C6713B      
Ersa TMS320C6713B      
Ersa New Tray Update 02/Sep/2015      

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