Texas Instruments_TMS320VC5510AGBC2

Texas Instruments
TMS320VC5510AGBC2  
DSP

Texas Instruments
TMS320VC5510AGBC2
698-TMS320VC5510AGBC2
Ersa
Texas Instruments-TMS320VC5510AGBC2-datasheets-5300187.pdf
IC DSP FIXED POINT LP 240-BGA
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TMS320VC5510AGBC2 Description

TMS320VC5510AGBC2 Description

The TMS320VC5510AGBC2 is a high-performance, low-power digital signal processor (DSP) from Texas Instruments, designed for a wide range of embedded applications. This IC belongs to the TMS320C55x series, known for its robust processing capabilities and energy efficiency. The TMS320VC5510AGBC2 operates within a temperature range of 0°C to 85°C, making it suitable for industrial and consumer applications where environmental conditions may vary.

This DSP features a clock rate of 200MHz, providing rapid processing speeds for complex algorithms and real-time data handling. It is equipped with 32kB of ROM for non-volatile memory storage, ensuring that critical data and instructions are retained even when power is lost. The on-chip RAM of 320kB allows for efficient data manipulation and storage during processing tasks.

The TMS320VC5510AGBC2 is designed for surface mount technology, offering a compact and reliable solution for modern circuit board designs. It operates with a core voltage of 1.60V and an I/O voltage of 3.30V, ensuring compatibility with a variety of peripheral devices and power supply systems. The product is packaged in a tray format, facilitating easy handling and integration into manufacturing processes.

TMS320VC5510AGBC2 Features

  • High Clock Rate: The 200MHz clock rate ensures fast execution of DSP algorithms, making it ideal for real-time processing applications.
  • Non-Volatile Memory: 32kB of ROM provides secure storage for firmware and critical data, enhancing system reliability.
  • On-Chip RAM: 320kB of on-chip RAM allows for efficient data handling and minimizes the need for external memory, reducing system complexity and cost.
  • Low Power Consumption: Designed for low power operation, this DSP is suitable for battery-powered and energy-sensitive applications.
  • Surface Mount Technology: The surface mount package type ensures a compact and reliable design, ideal for modern electronics manufacturing.
  • Host Interface and McBSP: The inclusion of a host interface and McBSP (Multichannel Buffered Serial Port) allows for versatile communication with other devices and systems.
  • Moisture Sensitivity Level: MSL 3 (168 Hours) ensures that the component can withstand typical manufacturing processes without degradation.

TMS320VC5510AGBC2 Applications

The TMS320VC5510AGBC2 is well-suited for a variety of applications, including:

  • Audio Processing: Ideal for digital audio effects, equalization, and noise reduction in consumer electronics and professional audio equipment.
  • Telecommunications: Used in baseband processing for wireless communication systems, providing efficient signal processing and modulation.
  • Industrial Control: Suitable for real-time control systems, motor control, and signal processing in industrial environments.
  • Medical Devices: Applicable in medical imaging, signal processing, and monitoring equipment where high performance and reliability are critical.
  • Consumer Electronics: Appropriate for smart home devices, wearable technology, and other consumer products requiring advanced signal processing capabilities.

Conclusion of TMS320VC5510AGBC2

The TMS320VC5510AGBC2 is a versatile and high-performance DSP that offers significant advantages over similar models. Its combination of a high clock rate, substantial on-chip RAM, and low power consumption makes it an ideal choice for a wide range of applications. The inclusion of a host interface and McBSP further enhances its connectivity options, making it a comprehensive solution for embedded systems. Whether used in audio processing, telecommunications, industrial control, or consumer electronics, the TMS320VC5510AGBC2 provides reliable performance and efficient processing capabilities, making it a standout choice in the electronics industry.

Tech Specifications

Program Memory Type
PPAP
Data Bus Width (bit)
Product Status
SPI
Automotive
Supplier Package
Package / Case
Core Architecture
REACH Status
Family Name
EU RoHS
Moisture Sensitivity Level (MSL)
Operating Temperature
ECCN
Mounting Type
Numeric and Arithmetic Format
Standard Package Name
Pin Count
Mounting
Clock Rate
CAN
USART
Ethernet
SVHC
Program Memory Size
Typical Operating Supply Voltage (V)
HTSUS
Package
Programmability
Non-Volatile Memory
PCB changed
HTS
ECCN (US)
Device Core
Supplier Device Package
Maximum Operating Temperature (°C)
Package Height
Mfr
I2C
RoHS Status
On-Chip RAM
USB
SVHC Exceeds Threshold
RAM Size
UART
I2S
Package Length
Series
Type
Voltage - Core
Part Status
Number of I/Os
Voltage - I/O
Package Width
Interface
Base Product Number
I/O Voltage
Product
L1 Cache Instruction Memory
RoHS
Supply Voltage - Min
Maximum Clock Frequency
Maximum Operating Temperature
Supply Voltage - Max
Data RAM Size
Core
Mounting Style
Watchdog Timers
Minimum Operating Temperature
Number of Timers/Counters
L1 Cache Data Memory
Moisture Sensitive
Instruction Type
Operating Supply Voltage
Data ROM Size
USHTS
Number of Cores

TMS320VC5510AGBC2 Documents

Download datasheets and manufacturer documentation for TMS320VC5510AGBC2

Ersa TMS320VC5510AZGW1 Datasheet      

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