Texas Instruments

TUSB1310AZAYR

TUSB1310AZAYR Description

The TUSB1310AZAYR from Texas Instruments is a high-performance USB 3.0 transceiver designed for surface-mount applications. This 1/1 driver/receiver IC operates across multiple voltage levels (1.1V, 1.8V, and 3.3V), ensuring compatibility with a wide range of host and peripheral devices. Packaged in a 175NFBGA format and supplied in Tape & Reel (TR), it is optimized for automated assembly processes. The device is RoHS3 compliant and adheres to REACH regulations, making it suitable for environmentally conscious designs.

TUSB1310AZAYR Features

• USB 3.0 Protocol Support: Enables SuperSpeed (5Gbps) data transfer, backward-compatible with USB 2.0.
• Multi-Voltage Operation: Flexible 1.1V, 1.8V, and 3.3V supply rails for seamless integration into mixed-voltage systems.
• Robust Signal Integrity: Features 270 mV receiver hysteresis, enhancing noise immunity in high-speed applications.
• Compact Form Factor: 175NFBGA package saves board space while maintaining thermal and electrical performance.
• Compliance & Reliability: ROHS3 compliant, REACH unaffected, and MSL 3 (168 hours) rated for extended shelf life.

TUSB1310AZAYR Applications

• High-Speed Data Acquisition Systems: Ideal for medical imaging and industrial automation where USB 3.0 bandwidth is critical.
• Embedded USB Host/Peripheral Designs: Suitable for single-board computers (SBCs) and IoT gateways requiring reliable connectivity.
• Consumer Electronics: Used in 4K video capture devices and external storage solutions due to low-latency performance.
• Automotive Infotainment: Supports in-vehicle USB hubs with robust EMC characteristics.

Conclusion of TUSB1310AZAYR

The TUSB1310AZAYR stands out as a versatile, high-speed USB 3.0 transceiver with multi-voltage support and superior noise immunity. While it is not recommended for new designs, its proven reliability makes it a strong choice for legacy systems or cost-sensitive upgrades. Its compact BGA package and compliance certifications further enhance its appeal for space-constrained, high-performance applications. Engineers seeking a drop-in solution for USB 3.0 connectivity will find this IC a balanced blend of performance and integration ease.