Trenz Electronic_TE0803-02-04EV-1EA
Trenz Electronic_TE0803-02-04EV-1EA
original

Trenz Electronic
TE0803-02-04EV-1EA

721-TE0803-02-04EV-1EA
PDF Datasheet
IC MODULE ZYNQ USCALE 2GB 128MB

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Tech Specifications

Core Processor
Zynq UltraScale+ XCZU4EV-1SFVC784E
Speed
-
Operating Temperature
0°C ~ 85°C
Flash Size
128MB
RAM Size
2GB
ECCN
5A002A1
Size / Dimension
2.050" L x 2.990" W (52.00mm x 76.00mm)
Product Status
Obsolete
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TE0803-02-04EV-1EA Description

TE0803-02-04EV-1EA Description

The TE0803-02-04EV-1EA is an advanced embedded IC module designed by Trenz Electronic GmbH, a leading manufacturer in the electronics industry. This MPU Core module is part of the TE0803 series and features a compact size of 2.050" L x 2.990" W (52.00mm x 76.00mm), making it suitable for applications where space is a critical factor. Despite its small footprint, the TE0803-02-04EV-1EA boasts a robust set of technical specifications, including a 2GB RAM and 128MB flash memory, which provide ample storage and processing capabilities.

The module operates within a temperature range of 0°C to 85°C, ensuring reliable performance in various environmental conditions. It is packaged in bulk and features a B2B connector type, facilitating easy integration into larger systems. The TE0803-02-04EV-1EA is classified under ECCN 5A002A1 and HTSUS 8471.50.0150, and it is important to note that it has been marked as obsolete, indicating that it may no longer be in active production.

TE0803-02-04EV-1EA Features

The TE0803-02-04EV-1EA offers several unique features that set it apart from similar models in the market:

  • High Memory Capacity: With 2GB of RAM and 128MB of flash memory, this module provides significant storage and processing power, making it ideal for complex embedded applications.
  • Wide Operating Temperature Range: The module's ability to operate between 0°C and 85°C ensures it can be deployed in a variety of environments, from cold storage facilities to industrial settings with high ambient temperatures.
  • Compact Design: The small form factor of 2.050" L x 2.990" W (52.00mm x 76.00mm) allows for integration into space-constrained systems without compromising on performance.
  • Easy Integration: The B2B connector type simplifies the process of connecting the module to other components, reducing development time and potential integration issues.
  • Bulk Packaging: The bulk packaging option ensures cost-effective procurement, especially for applications requiring multiple units.

TE0803-02-04EV-1EA Applications

The TE0803-02-04EV-1EA is well-suited for a range of applications due to its high memory capacity, compact size, and wide operating temperature range. Some specific use cases include:

  • Industrial Automation: The module's robust performance and wide temperature range make it ideal for industrial control systems, where reliability and durability are paramount.
  • Embedded Systems: Its high memory capacity and compact design make it suitable for embedded systems in consumer electronics, medical devices, and automotive applications.
  • Data Acquisition Systems: The TE0803-02-04EV-1EA can be used in data acquisition systems where large amounts of data need to be processed and stored efficiently.
  • Telecommunications: The module's performance benefits make it a good fit for telecommunications infrastructure, where high-speed data processing and storage are required.

Conclusion of TE0803-02-04EV-1EA

The TE0803-02-04EV-1EA is a versatile and powerful embedded IC module that offers significant advantages over similar models. Its high memory capacity, wide operating temperature range, and compact design make it suitable for a variety of applications, from industrial automation to data acquisition systems. While it is now marked as obsolete, the TE0803-02-04EV-1EA remains a reliable choice for engineers and designers looking for a robust and efficient MPU Core module.

FAQ

What is TE0803-02-04EV-1EA?
TE0803-02-04EV-1EA is a Microcontrollers, Microprocessor, FPGA Modules from Trenz Electronic. This product page provides its main specifications, pricing information, availability, and inquiry options.
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