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TE0820-04-3BE21FL

TE0820-04-3BE21FL Description

The TE0820-04-3BE21FL is a high-performance embedded IC chip designed by Trenz Electronic GmbH, a renowned manufacturer in the electronics industry. This MPU Core module is part of the TE0820 series and is equipped with a Zynq UltraScale+ MPSoC ZU3EG-1E processor, featuring 2GB of DDR4 RAM and 128MB of flash memory. The module operates within a temperature range of 0°C to 85°C, making it suitable for a variety of industrial and embedded applications. Despite its obsolescence, the TE0820-04-3BE21FL remains a robust solution for systems requiring high computational power and reliable data storage.

TE0820-04-3BE21FL Features

• High Memory Capacity: The TE0820-04-3BE21FL boasts 2GB of DDR4 RAM and 128MB of flash memory, providing ample storage and fast data access capabilities. This combination ensures efficient handling of complex tasks and large datasets.
• Wide Operating Temperature Range: With an operating temperature range of 0°C to 85°C, this module is well-suited for environments with varying temperature conditions, ensuring consistent performance across different climates.
• Compact Design: Measuring 1.970" in length and 1.570" in width (50.00mm x 40.00mm), the TE0820-04-3BE21FL offers a compact footprint, making it ideal for space-constrained applications.
• RoHS3 Compliant: The module adheres to RoHS3 standards, ensuring environmental sustainability and compliance with global regulations.
• Samtec LSHM Connector: The use of a Samtec LSHM connector ensures reliable and high-speed data transfer, facilitating seamless integration with other components.
• Bulk Packaging: Available in bulk packaging, the TE0820-04-3BE21FL is suitable for large-scale deployments and inventory management.

TE0820-04-3BE21FL Applications

The TE0820-04-3BE21FL is designed for a wide range of applications, including but not limited to:

• Industrial Automation: The module's high memory capacity and robust performance make it ideal for controlling complex machinery and automated systems.
• Embedded Systems: Its compact size and high performance are well-suited for embedded systems requiring efficient data processing and storage.
• Communication Systems: The TE0820-04-3BE21FL can be utilized in communication systems where high-speed data transfer and reliable operation are critical.
• Medical Devices: The module's reliability and compliance with environmental standards make it suitable for medical devices requiring high precision and data integrity.

Conclusion of TE0820-04-3BE21FL

The TE0820-04-3BE21FL, despite being obsolete, remains a powerful and versatile embedded IC chip. Its high memory capacity, wide operating temperature range, and compact design make it an excellent choice for a variety of applications. The module's RoHS3 compliance and use of a Samtec LSHM connector further enhance its reliability and integration capabilities. For applications requiring high computational power and reliable data storage, the TE0820-04-3BE21FL continues to offer significant benefits and remains a valuable solution in the electronics industry.