Trenz Electronic_TE0821-01-3AE31PA
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Trenz Electronic
TE0821-01-3AE31PA

721-TE0821-01-3AE31PA
MPSOC MODULE WITH XILINX ZYNQ UL
52 Weeks

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Tech Specifications

Core Processor
Zynq UltraScale+ XCZU3CG-1SFVC784E
Speed
-
Operating Temperature
0°C ~ 85°C
Flash Size
128MB
RAM Size
4GB
Size / Dimension
1.970" L x 1.570" W (50.00mm x 40.00mm)
Product Status
Active
Series
TE0823
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TE0821-01-3AE31PA Description

TE0821-01-3AE31PA Description

The TE0821-01-3AE31PA is a high-performance MPSoC module designed by Trenz Electronic GmbH, featuring the Xilinx Zynq UltraScale+ MPSoC. This module is part of the TE0823 series and is ideal for applications requiring advanced processing capabilities and flexibility. The module boasts a robust set of features, including a 128MB flash size and 4GB of RAM, ensuring ample storage and memory for complex operations. It operates within a temperature range of 0°C to 85°C, making it suitable for a variety of industrial and commercial environments. The module measures 1.970" in length and 1.570" in width (50.00mm x 40.00mm), offering a compact form factor that can be easily integrated into various systems. The TE0821-01-3AE31PA is available in bulk packaging and is RoHS3 compliant, adhering to stringent environmental standards. With a connector type of 2 x 100 Pin, it provides extensive connectivity options. The module is currently active in the market, ensuring availability and support for ongoing projects.

TE0821-01-3AE31PA Features

The TE0821-01-3AE31PA offers several key features that set it apart from similar modules in the market:

  • Advanced Processing Capabilities: The integration of the Xilinx Zynq UltraScale+ MPSoC provides superior processing power and flexibility, enabling the module to handle complex tasks with ease.
  • Ample Storage and Memory: With 128MB of flash storage and 4GB of RAM, the module can store significant amounts of data and run multiple applications simultaneously without performance degradation.
  • Wide Operating Temperature Range: The module's operating temperature range of 0°C to 85°C makes it suitable for deployment in various environmental conditions, from cold industrial settings to hot commercial environments.
  • Compact Design: Measuring 1.970" L x 1.570" W (50.00mm x 40.00mm), the TE0821-01-3AE31PA offers a compact form factor that can be easily integrated into space-constrained systems.
  • Extensive Connectivity: The 2 x 100 Pin connector type provides extensive connectivity options, allowing for seamless integration with other components and systems.
  • Environmental Compliance: The module is RoHS3 compliant, ensuring it meets stringent environmental standards and is suitable for use in eco-friendly applications.
  • Bulk Packaging: Available in bulk packaging, the TE0821-01-3AE31PA is ideal for large-scale deployments and projects requiring multiple units.

TE0821-01-3AE31PA Applications

The TE0821-01-3AE31PA is versatile and can be applied in various industries and applications, including:

  • Industrial Automation: The module's advanced processing capabilities and extensive connectivity options make it ideal for controlling and monitoring industrial processes, ensuring efficient and reliable operations.
  • Embedded Systems: Its compact design and ample storage and memory make it suitable for developing sophisticated embedded systems, such as smart sensors and IoT devices.
  • Medical Devices: The wide operating temperature range and RoHS3 compliance make the TE0821-01-3AE31PA suitable for use in medical devices that require high performance and reliability.
  • Telecommunications: The module can be used in telecommunications infrastructure to manage and process data efficiently, ensuring seamless communication and network performance.
  • Research and Development: The flexibility and processing power of the TE0821-01-3AE31PA make it an excellent tool for research and development projects, enabling rapid prototyping and testing of new technologies.

Conclusion of TE0821-01-3AE31PA

The TE0821-01-3AE31PA is a powerful and versatile MPSoC module that offers a range of advanced features and benefits. Its integration of the Xilinx Zynq UltraScale+ MPSoC, ample storage and memory, wide operating temperature range, and compact design make it an ideal choice for a variety of applications, from industrial automation to medical devices. The extensive connectivity options and RoHS3 compliance further enhance its appeal, making it a reliable and eco-friendly solution. Whether for large-scale deployments or sophisticated embedded systems, the TE0821-01-3AE31PA stands out as a high-performance module that delivers exceptional value and performance.

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