TT Electronics/IRC
DIP-1998-06-1211-J

50-DIP-1998-06-1211-J
PDF Datasheet
Res Thin Film NET 1.21K Ohm 5% 1.5W ±50ppm/°C BUS Ceramic 16-Pin DIP Pin Thru-Hole Box/Bulk
24 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
15
HTS
8533.21.00.60
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 150
PPAP
No
Automotive
No
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DIP-1998-06-1211-J Description

DIP-1998-06-1211-J Description

The DIP-1998-06-1211-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. Encased in a 16-pin ceramic DIP package, it features 15 resistors with a 1.21KΩ resistance value, 5% tolerance, and a ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 150°C. With a 1.5W total power rating (0.1W per resistor) and a 100V maximum voltage rating, this network is engineered for reliability in demanding environments. Its through-hole mounting and 2.54mm terminal pitch facilitate easy integration into PCB designs.

DIP-1998-06-1211-J Features

  • Ceramic Case Style: Enhances thermal stability and durability.
  • Thin Film Technology: Delivers superior precision and low noise compared to thick-film alternatives.
  • High Power Handling: 1.5W total dissipation (0.1W per resistor) for robust operation.
  • Wide Temperature Range: Operates reliably from 70°C to 150°C with derated power.
  • Compact Dimensions: 20.32mm (L) × 7.87mm (D) × 2.03mm (H) with a low 2.67mm seated height, saving board space.
  • EU RoHS Compliant: Meets environmental standards for global use.
  • Pin Termination: Ensures secure through-hole mounting for high-vibration applications.

DIP-1998-06-1211-J Applications

This resistor network is ideal for:

  • Precision Analog Circuits: Voltage dividers, feedback networks, and signal conditioning.
  • Industrial Control Systems: PLCs, motor drives, and power supplies requiring stable resistance values.
  • Test & Measurement Equipment: Calibration tools and instrumentation where low TCR (±50ppm/°C) is critical.
  • Automotive & Aerospace (Non-Automotive Rated): Non-safety-critical subsystems benefiting from ceramic encapsulation.
  • Embedded Systems: DIP packaging simplifies prototyping and legacy designs.

Conclusion of DIP-1998-06-1211-J

The DIP-1998-06-1211-J stands out for its thin-film accuracy, ceramic robustness, and high-power density, making it a superior choice over generic thick-film networks. Its 5% tolerance and low TCR ensure consistent performance in precision applications, while the DIP-16 form factor offers compatibility with standard layouts. Ideal for industrial, instrumentation, and embedded systems, this resistor network combines reliability with ease of integration. Available in box/bulk packaging, it suits both prototyping and volume production.

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