TT Electronics/IRC

GQ0A021003JFT

GQ0A021003JFT Description

The GQ0A021003JFT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications requiring stable resistance values and reliable isolation. This 10-resistor array features a 100K Ohm resistance per element with a 5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring minimal drift across its operating range of 70°C to 125°C. Housed in a 20-pin QSOP package with gull-wing terminations, it offers a compact 8.66mm × 6.02mm × 1.47mm footprint, making it ideal for space-constrained surface-mount (SMD) designs. The ceramic case provides excellent thermal stability, while the isolated (ISOL) circuit design ensures independent resistor performance. Rated for 1W total power dissipation (0.1W per resistor) and 100V maximum voltage, it suits demanding industrial and instrumentation applications.

GQ0A021003JFT Features

• Precision Thin Film Technology: Delivers stable resistance with ±50ppm/°C TCR for high-temperature environments.
• Robust Construction: Ceramic QSOP package enhances durability and heat dissipation.
• Isolated Resistors: Independent 100K Ohm elements (10 total) prevent cross-talk in sensitive circuits.
• Space-Efficient: Compact 20-pin gull-wing SMD design (0.64mm pitch) optimizes PCB real estate.
• Wide Operating Range: Functions reliably from 70°C to 125°C with derated power.
• High Voltage Tolerance: 100V rating per resistor for robust signal conditioning.

GQ0A021003JFT Applications

• Industrial Control Systems: Signal isolation and voltage division in PLCs and sensors.
• Test & Measurement Equipment: Precision resistor networks for calibration circuits.
• Medical Electronics: Stable resistance in diagnostic devices where accuracy is critical.
• Automotive Electronics (non-Automotive grade): Auxiliary systems requiring thermal resilience.
• Telecom Infrastructure: Impedance matching in high-frequency modules.

Conclusion of GQ0A021003JFT

The GQ0A021003JFT excels in applications demanding precision, thermal stability, and compactness. Its thin-film isolation, ceramic packaging, and gull-wing SMD compatibility make it a superior choice over bulkier or less stable alternatives. While not PPAP or Automotive-grade, it is ideal for industrial, medical, and telecom designs where consistent performance under thermal stress is paramount. Engineers will appreciate its balance of power handling, tolerance, and footprint efficiency.