TT Electronics/IRC

GQ0A038250DAT

GQ0A038250DAT Description

The GQ0A038250DAT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 20-pin QSOP package features 10 isolated resistors, each with a 825Ω resistance value and a tight ±0.5% tolerance, ensuring exceptional accuracy. The device operates over a wide temperature range (70°C to 125°C) with a low ±25ppm/°C temperature coefficient, making it ideal for stable performance in varying thermal conditions. Encased in a ceramic package, it offers superior durability and thermal dissipation, with a 1W total power rating (0.1W per resistor) and a 100V maximum voltage rating. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GQ0A038250DAT Features

• Precision Performance: Thin-film technology delivers ±0.5% tolerance and ±25ppm/°C TCR for stable, low-drift operation.
• Robust Construction: Ceramic case ensures high thermal conductivity and mechanical strength.
• High-Density Design: QSOP-20 package (8.66mm × 6.02mm × 1.47mm) optimizes board space in compact layouts.
• Isolated Resistors: 10 independent resistors (825Ω each) prevent cross-talk, suitable for signal isolation.
• Reliable Power Handling: 1W total dissipation (0.1W per resistor) with derating up to 125°C.
• Automated Assembly-Friendly: Gull-wing leads and 0.64mm pitch enable seamless SMT processing.

GQ0A038250DAT Applications

This resistor network excels in precision analog and mixed-signal circuits, including:

• Medical Equipment: Patient monitoring systems requiring stable signal conditioning.
• Industrial Controls: PLCs and sensor interfaces where temperature stability is critical.
• Test & Measurement: Calibration tools and high-accuracy instrumentation.
• Telecommunications: Signal filtering and impedance matching in RF modules.
• Aerospace & Defense: Avionics systems demanding reliability under thermal stress.

Conclusion of GQ0A038250DAT

The GQ0A038250DAT stands out for its precision, isolation, and rugged ceramic packaging, making it a superior choice for applications requiring high accuracy and thermal resilience. While not RoHS-compliant and unconfirmed for automotive use, its thin-film technology and QSOP form factor cater to industrial, medical, and telecom sectors. Engineers will appreciate its balance of performance, density, and power handling, particularly in space-constrained, high-reliability designs.