TT Electronics/IRC

GQ0B021332GDT

GQ0B021332GDT Description

The GQ0B021332GDT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 19-resistor array features a 13.3KΩ resistance value per resistor with a tight 2% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 20-pin QSOP (Ceramic) package with gull-wing SMD termination, it offers excellent thermal and mechanical stability. The 1W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for high-reliability circuits. Its compact dimensions (8.66mm x 6.02mm x 1.47mm) and ±0.1mm height tolerance ensure compatibility with space-constrained designs.

GQ0B021332GDT Features

• Precision Thin Film Technology: Delivers low noise and high stability.
• 19 Resistors in BUS Configuration: Ideal for balanced signal distribution.
• Ceramic QSOP Package: Enhances thermal dissipation and durability.
• Wide Operating Range: Rated for -55°C to +125°C with derated power up to 125°C.
• Surface-Mount Gull Wing Terminals: Facilitates automated PCB assembly.
• Low TCR (±50ppm/°C): Minimizes resistance drift under thermal stress.
• Non-Automotive, Non-PPAP: Suitable for industrial and commercial applications.

GQ0B021332GDT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
• Medical Equipment: High-accuracy circuits in diagnostic devices.
• Test & Measurement Instruments: Stable reference networks for calibration.
• Telecom Infrastructure: Impedance matching in RF modules.
• Industrial Control Systems: Robust performance in harsh environments.

Conclusion of GQ0B021332GDT

The GQ0B021332GDT combines precision, compactness, and reliability, making it a standout choice for engineers requiring stable resistor networks in critical applications. Its ceramic QSOP package, low TCR, and BUS configuration provide distinct advantages over plastic-encapsulated alternatives, particularly in thermal management and long-term stability. While not RoHS-compliant, it remains a top-tier solution for non-consumer applications where performance outweighs regulatory constraints.