TT Electronics/IRC

GQ0B021372JDT

GQ0B021372JDT Description

The GQ0B021372JDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 19-resistor array features a 13.7K Ohm resistance value with a 5% tolerance and a ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Housed in a 20-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a maximum voltage rating of 100V. Its gull-wing termination and surface-mount design make it ideal for automated assembly processes. The ceramic case provides excellent thermal stability, while the thin-film technology ensures low noise and high accuracy.

GQ0B021372JDT Features

• High-Density Integration: 19 resistors in a compact QSOP package (8.66mm x 6.02mm x 1.47mm).
• Robust Construction: Ceramic substrate enhances thermal management and durability.
• Precision Performance: ±50ppm/°C TCR and 5% tolerance for reliable signal conditioning.
• Automation-Friendly: Gull-wing leads and 0.64mm pitch for seamless SMT compatibility.
• Wide Operating Range: Rated for -55°C to +125°C, suitable for industrial environments.
• Non-Automotive: Compliant with EAR99 ECCN but not PPAP or automotive-grade.

GQ0B021372JDT Applications

This resistor network excels in:

• Analog Signal Processing: Voltage dividers, pull-up/pull-down networks in PCBs.
• Industrial Control Systems: Precision measurement circuits requiring low drift.
• Test & Measurement Equipment: High-accuracy instrumentation.
• Communication Devices: Signal conditioning in RF modules and data converters.
• Medical Electronics: Stable performance in diagnostic equipment.

Conclusion of GQ0B021372JDT

The GQ0B021372JDT combines thin-film precision, compact packaging, and thermal resilience, making it a superior choice for applications demanding stable resistance values under varying conditions. While not suited for automotive use, its ceramic construction and low TCR provide a competitive edge in industrial and communication systems. Ideal for engineers prioritizing reliability, space efficiency, and ease of integration in high-density designs.