TT Electronics/IRC

GQ0B0273R2GDT

GQ0B0273R2GDT Description

The GQ0B0273R2GDT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 19-resistor BUS-configuration array features a 73.2 Ω resistance value with a tight 2% tolerance and a low ±50 ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 20-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for high-reliability circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the rectangular ceramic case provides excellent thermal and mechanical stability.

GQ0B0273R2GDT Features

• Precision Thin Film Technology: Delivers low noise and high accuracy for sensitive analog/digital circuits.
• Robust Ceramic Package: Enhances thermal dissipation and durability in harsh environments.
• BUS Configuration: Simplifies PCB layout with a common node design, ideal for voltage division or pull-up/down networks.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
• Compact QSOP-20 Footprint: Saves board space (8.66mm × 6.02mm × 1.63mm) with a 0.64mm terminal pitch.
• Non-Automotive, Non-PPAP: Suitable for industrial, telecom, and instrumentation applications.

GQ0B0273R2GDT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers in data acquisition systems.
• Digital Pull-Up/Down Arrays: Ensuring stable logic levels in microcontrollers and FPGAs.
• Medical/Test Equipment: Where low TCR and tight tolerance are critical.
• Telecom Infrastructure: High-frequency signal integrity in base stations and routers.
• Industrial Controls: Reliable performance in motor drives and power management circuits.

Conclusion of GQ0B0273R2GDT

The GQ0B0273R2GDT combines precision, compactness, and ruggedness, making it a standout choice for engineers needing reliable resistor networks in space-constrained, high-performance designs. Its ceramic construction, BUS topology, and thin-film technology offer superior stability over plastic-encased alternatives, though its non-RoHS compliance may limit use in eco-sensitive applications. Ideal for industrial and telecom systems, this component balances cost and performance for mid-to-high-end electronic assemblies.