TT Electronics/IRC

GQ0B028251JDT

GQ0B028251JDT Description

The GQ0B028251JDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 19-resistor array features an 8.25KΩ resistance value per resistor with a 5% tolerance and a ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Encased in a ceramic QSOP package, it offers a 1W total power rating (0.05W per resistor) and supports 100V maximum voltage. Its 20-pin gull-wing SMD termination and 0.64mm terminal pitch facilitate easy surface mounting in compact PCB designs.

GQ0B028251JDT Features

• High-Density Integration: 19 resistors in a 6.02mm x 8.66mm footprint, ideal for space-constrained applications.
• Robust Construction: Ceramic case ensures durability and excellent thermal dissipation.
• Precision Stability: ±50ppm/°C TCR and 5% tolerance for reliable signal conditioning.
• Wide Operating Range: Rated for -55°C to +125°C, suitable for industrial environments.
• Surface-Mount Ready: Gull-wing leads and QSOP package simplify automated assembly.
• Non-Automotive Grade: Compliant with EAR99 ECCN but not PPAP or RoHS certified.

GQ0B028251JDT Applications

This resistor network excels in:

• Analog Signal Processing: Voltage dividers, DAC/ADC circuits.
• Bus Termination: Ideal for BUS circuit designators in communication systems.
• Industrial Controls: PLCs, sensor interfaces, and power management.
• Test & Measurement Equipment: Precision instrumentation requiring stable resistance values.
• Consumer Electronics: Compact devices needing high-density passive components.

Conclusion of GQ0B028251JDT

The GQ0B028251JDT stands out for its thin-film technology, compact QSOP packaging, and balanced performance in precision circuits. While not suited for automotive or RoHS-mandated designs, its thermal stability, power handling, and space efficiency make it a top choice for industrial and consumer electronics. Engineers will appreciate its repeatability in high-density layouts and cost-effectiveness for medium-volume production.