TT Electronics/IRC

GQ8A011333GT

GQ8A011333GT Description

The GQ8A011333GT from TT Electronics/IRC is a high-performance 8-resistor thin film network designed for precision applications. Encased in a ceramic QSOP package, it features a 133K Ohm resistance value with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. With a 0.75W (3/4W) total power rating and 0.1W per resistor, this 16-pin gull-wing SMD component is ideal for isolated circuit designs (ISOL). Its 100V maximum voltage rating and thin film technology provide superior reliability in demanding environments.

GQ8A011333GT Features

• Ceramic QSOP Case: Enhances thermal stability and durability.
• Thin Film Technology: Delivers high precision and low noise.
• 8 Resistors in Isolated Configuration: Enables flexible circuit design.
• Wide Temperature Range: Operates reliably from 70°C to 125°C.
• Low TCR (±100ppm/°C): Minimizes resistance drift under thermal stress.
• Gull Wing Termination: Facilitates easy surface-mount (SMD) assembly.
• Compact Dimensions: 4.9mm (L) x 6.02mm (D) x 1.47mm (H) with tight tolerances (±0.1mm).
• Non-Automotive, Non-PPAP: Suitable for industrial and commercial applications.

GQ8A011333GT Applications

This resistor network excels in:

• Precision analog circuits requiring stable resistance values.
• Signal conditioning and isolation in measurement equipment.
• Medical devices where low noise and reliability are critical.
• Industrial control systems operating in high-temperature environments.
• Telecommunications infrastructure demanding consistent performance.

Conclusion of GQ8A011333GT

The GQ8A011333GT stands out for its ceramic-encased robustness, thin film accuracy, and isolated resistor configuration, making it a top choice for engineers prioritizing thermal stability and precision. While not RoHS-compliant, its high power rating, low TCR, and compact form factor make it ideal for industrial, medical, and telecom applications where reliability under thermal stress is paramount. Its QSOP gull-wing package ensures compatibility with modern SMD assembly processes, offering a balance of performance and manufacturability.