


TT Electronics/IRC
GQ8A028060CT
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GQ8A028060CT Description
GQ8A028060CT Description
The GQ8A028060CT from TT Electronics/IRC is a high-precision 8-resistor thin film network designed for demanding isolation and signal conditioning applications. Housed in a 16-pin QSOP ceramic package, it offers 806Ω resistance per element with an exceptional ±0.25% tolerance and ±50ppm/°C temperature coefficient, ensuring stability across a wide operating range (70°C to 125°C). The 0.75W (3/4W) total power rating and 100V maximum voltage make it suitable for robust circuit designs. Its gull-wing termination and surface-mount (SMD) form factor facilitate automated assembly, while the ceramic case enhances thermal and mechanical reliability.
GQ8A028060CT Features
- Precision Performance: Ultra-tight 0.25% tolerance and ±50ppm/°C TCR for critical analog/digital systems.
- Robust Construction: Ceramic substrate ensures durability and low thermal resistance.
- High Power Handling: 0.1W per resistor (0.75W total) derated up to 125°C.
- Isolation-Centric Design: "ISOL" circuit configuration minimizes crosstalk in multi-channel applications.
- Compact & Reliable: QSOP package (4.9mm × 6.02mm × 1.47mm) with ±0.1mm dimensional tolerances for space-constrained PCBs.
- Industry-Standard Compliance: EAR99 ECCN and non-RoHS status (note for legacy designs).
GQ8A028060CT Applications
- Industrial Automation: Signal isolation in PLCs, ADCs, and sensor interfaces.
- Medical Electronics: Precision voltage dividers in diagnostic equipment.
- Telecom Infrastructure: Impedance matching and termination in high-frequency modules.
- Test & Measurement: Calibration circuits requiring long-term stability.
- Aerospace & Defense: Ruggedized systems where ceramic packages excel.
Conclusion of GQ8A028060CT
The GQ8A028060CT stands out for its combination of precision, power handling, and isolation properties, making it ideal for applications demanding repeatable performance under thermal stress. While not PPAP or automotive-qualified, its thin-film technology and ceramic packaging offer superior reliability versus polymer-based arrays. Engineers should evaluate its non-RoHS status for modern designs but will benefit from its proven performance in harsh environments.



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