TT Electronics/IRC

GQ8B011070JDT

GQ8B011070JDT Description

The GQ8B011070JDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a 107Ω resistance value, each rated at 0.05W (1/20W) and a 5% tolerance, delivering a total power rating of 0.75W (3/4W). The network features a ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Encased in a ceramic package, it offers superior thermal and mechanical stability, with gull-wing terminations for reliable surface-mount (SMD) assembly.

GQ8B011070JDT Features

• High-Density Integration: 15 resistors in a compact QSOP-16 package (4.9mm x 6.02mm x 1.47mm), ideal for space-constrained designs.
• Robust Construction: Ceramic case ensures durability and efficient heat dissipation, suitable for harsh environments.
• Precision Performance: ±100ppm/°C TCR and 5% tolerance provide consistent resistance under varying thermal conditions.
• Wide Voltage Range: Supports up to 100V, making it versatile for analog and digital circuits.
• Automated Assembly Compatible: Gull-wing leads with 0.64mm pitch enable high-speed pick-and-place processes.
• Non-Automotive Grade: Designed for industrial and commercial applications where PPAP compliance is not required.

GQ8B011070JDT Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers and pull-up/pull-down networks in data acquisition systems.
• Analog Circuitry: Feedback networks in op-amp circuits and ADC/DAC interfaces.
• Power Management: Current-limiting and load-sharing in low-power DC/DC converters.
• Communication Systems: Impedance matching and termination in high-speed PCBs.
• Industrial Controls: Durable solution for PLC I/O modules and sensor interfaces.

Conclusion of GQ8B011070JDT

The GQ8B011070JDT stands out for its thin-film technology, ceramic encapsulation, and high-power density, offering reliability in precision applications. While not RoHS-compliant, its thermal stability and compact form factor make it a preferred choice for industrial electronics, test equipment, and embedded systems. Engineers will appreciate its balance of performance, durability, and ease of integration in surface-mount designs.