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GQ8B011822JDT
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GQ8B011822JDT Description
GQ8B011822JDT Description
The GQ8B011822JDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors, each with a 18.2KΩ resistance value and a 5% tolerance, ensuring consistent performance across a wide temperature range of 70°C to 125°C. The ceramic case style and gull-wing termination enable reliable surface-mount (SMD) integration, while the 0.05W (1/20W) power rating per resistor and 0.75W (3/4W) total power rating make it suitable for low-power, high-density designs. With a ±100ppm/°C temperature coefficient and 100V maximum voltage rating, this network offers stability in fluctuating thermal environments.
GQ8B011822JDT Features
- Thin-Film Technology: Delivers superior accuracy and low noise compared to thick-film alternatives.
- Ceramic Case: Enhances thermal management and mechanical durability.
- BUS Circuit Designator: Optimized for bus line termination and signal integrity.
- QSOP Package: Compact 4.9mm × 6.02mm × 1.47mm footprint with 0.64mm terminal pitch, ideal for space-constrained PCBs.
- Wide Temperature Range: Operates reliably up to 125°C, making it suitable for industrial and automotive (non-AEC-Q200) applications.
- Non-RoHS Compliant: Suitable for legacy or specialized systems where RoHS exemptions apply.
GQ8B011822JDT Applications
This resistor network excels in:
- Analog/Digital Signal Conditioning: Precision voltage dividers, pull-up/pull-down networks.
- Bus Termination: DDR memory, CAN, or I²C interfaces requiring stable impedance matching.
- Industrial Controls: PLCs, sensor interfaces, and power management circuits.
- Test & Measurement Equipment: Calibration circuits and reference voltage networks.
- Aerospace/Defense: Non-RoHS compliant systems with stringent reliability requirements.
Conclusion of GQ8B011822JDT
The GQ8B011822JDT stands out for its thin-film precision, robust ceramic construction, and compact QSOP packaging, offering engineers a reliable solution for high-density, thermally challenging designs. While not automotive-grade or RoHS-compliant, its ±100ppm/°C stability and 5% tolerance make it a cost-effective choice for industrial, communications, and legacy systems. For applications demanding tight resistance matching and low thermal drift, this network delivers consistent performance where generic arrays may fall short.



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