TT Electronics/IRC

GQ8B015112GGT

GQ8B015112GGT Description

The GQ8B015112GGT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 15-resistor array features a 51.1K Ohm resistance per element with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Housed in a 16-pin QSOP ceramic package, it offers excellent thermal stability and durability. The 0.75W (3/4W) total power rating and 0.05W (1/20W) per resistor make it suitable for power-sensitive designs. Its gull-wing termination and surface-mount (SMD) configuration facilitate easy PCB integration.

GQ8B015112GGT Features

• High Precision: 2% tolerance and ±100ppm/°C TCR for reliable signal conditioning.
• Robust Construction: Ceramic case and thin-film technology ensure longevity and thermal efficiency.
• Space-Saving Design: Compact QSOP package (4.9mm x 6.02mm x 1.47mm) with 0.64mm terminal pitch for high-density layouts.
• Wide Voltage Range: Supports up to 100V maximum voltage, ideal for industrial and automotive systems (non-automotive PPAP).
• Stable Performance: Operates reliably from -55°C to +125°C with derated power up to 125°C.
• Non-RoHS Compliant: Suitable for legacy or specialized applications requiring non-compliant materials.

GQ8B015112GGT Applications

• Analog Signal Processing: Precision voltage dividers, DAC/ADC interfaces.
• Industrial Controls: PLCs, sensor arrays, and instrumentation requiring stable resistance.
• Telecommunications: RF modules and signal conditioning circuits.
• Power Management: Load sharing, current sensing in power supplies.
• Test & Measurement Equipment: Calibration circuits and reference networks.

Conclusion of GQ8B015112GGT

The GQ8B015112GGT excels in precision, power efficiency, and miniaturization, making it a top choice for engineers needing reliable resistor networks in constrained spaces. Its ceramic construction and thin-film technology provide superior thermal performance, while the QSOP package ensures compatibility with modern SMD assembly processes. Ideal for industrial, telecom, and instrumentation applications, this model balances performance with cost-effectiveness for mid-to-high-volume production.