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GQ8B016800FBT
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GQ8B016800FBT Description
GQ8B016800FBT Description
The GQ8B016800FBT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors, each with a 680Ω resistance value and a tight 1% tolerance, ensuring consistent performance in precision circuits. Encased in a ceramic package, it offers excellent thermal stability and durability, with a maximum operating temperature of 125°C and a derated power range of 70°C to 125°C. The gull-wing termination facilitates reliable surface-mount (SMD) assembly, while the 0.64mm terminal pitch ensures compatibility with high-density PCB designs. With a total power rating of 0.75W (3/4W) and ±100ppm/°C temperature coefficient, this network is engineered for stability under varying thermal conditions.
GQ8B016800FBT Features
- High Precision: 1% tolerance and ±100ppm/°C TCR for reliable signal integrity.
- Robust Construction: Ceramic case and thin-film technology ensure long-term durability.
- Space-Efficient: Compact QSOP package (4.9mm x 6.02mm x 1.47mm) ideal for miniaturized designs.
- High Power Handling: 0.05W per resistor (0.75W total) supports moderate power applications.
- Wide Voltage Range: Maximum rating of 100V for versatile circuit integration.
- Automated Assembly Friendly: Gull-wing leads and surface-mount design streamline manufacturing.
GQ8B016800FBT Applications
This resistor network excels in:
- Analog/Digital Signal Conditioning: Precision voltage dividers, feedback networks.
- Industrial Control Systems: Stable performance in harsh environments (e.g., PLCs, sensors).
- Test & Measurement Equipment: High-accuracy instrumentation requiring low drift.
- Communication Hardware: Impedance matching in RF and baseband circuits.
- Medical Electronics: Reliable operation in diagnostic and monitoring devices.
Conclusion of GQ8B016800FBT
The GQ8B016800FBT combines precision, power efficiency, and compactness, making it a superior choice for engineers prioritizing thermal stability and space constraints. Its ceramic encapsulation and thin-film technology outperform standard thick-film networks in high-reliability scenarios. While not automotive-grade or RoHS-compliant, it remains a cost-effective solution for industrial, medical, and communication systems demanding tight tolerances and repeatable performance. Ideal for designs where miniaturization and electrical consistency are critical.



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