TT Electronics/IRC

GQ8B0168R1JDT

GQ8B0168R1JDT Description

The GQ8B0168R1JDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a 68.1Ω resistance value and a 5% tolerance, offering a 0.75W (3/4W) total power rating (0.05W per resistor). Its ceramic case ensures robust thermal and mechanical stability, while the gull-wing termination facilitates reliable surface-mount (SMD) assembly. Operating within a wide temperature range of -70°C to +125°C, this network is engineered for environments requiring consistent performance under thermal stress.

GQ8B0168R1JDT Features

• Thin-Film Technology: Delivers ±100ppm/°C temperature coefficient for minimal resistance drift.
• High Power Density: 0.75W total rating in a compact 4.9mm × 6.02mm × 1.47mm footprint.
• Ceramic Substrate: Enhances thermal conductivity and durability vs. polymer-based alternatives.
• BUS Configuration: Optimized for bus termination, pull-up/pull-down networks, and voltage division.
• Precision Gull Wing Leads: 0.64mm pitch ensures compatibility with automated PCB assembly.
• 100V Maximum Voltage Rating: Suitable for industrial and telecom applications.

GQ8B0168R1JDT Applications

This resistor network excels in:

• Analog/Digital Signal Conditioning: Ideal for ADC/DAC reference networks and sensor interfaces.
• Bus Termination: Mitigates signal reflection in high-speed data lines (e.g., DDR, PCIe).
• Power Management Circuits: Used in voltage dividers and bias networks for power ICs.
• Automotive & Industrial Systems: Despite non-automotive PPAP status, its 125°C rating suits harsh environments like motor controls or HVAC systems.
• Telecom Infrastructure: Reliable performance in base station PCBs and RF modules.

Conclusion of GQ8B0168R1JDT

The GQ8B0168R1JDT stands out for its thin-film precision, ceramic robustness, and high power-handling capability in a miniaturized QSOP package. While not RoHS-compliant, its thermal stability and low TCR make it a superior choice for engineers prioritizing long-term reliability in signal integrity and power distribution designs. Its BUS-oriented layout further simplifies circuit integration, reducing BOM complexity in multi-resistor applications.