TT Electronics/IRC

GQ8B0169R8FFT

GQ8B0169R8FFT Description

The GQ8B0169R8FFT from TT Electronics/IRC is a high-precision thin-film resistor network designed for surface-mount applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a 69.8Ω resistance value, offering 1% tolerance and a ±100ppm/°C temperature coefficient. Encased in a ceramic substrate, it ensures excellent thermal stability and reliability in demanding environments. With a 0.75W (3/4W) total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is engineered for high-density PCB designs where space and performance are critical.

GQ8B0169R8FFT Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive circuits.
• Ceramic Case: Enhances thermal dissipation and mechanical robustness.
• Gull Wing Termination: Facilitates reliable surface-mount soldering with a 0.64mm terminal pitch.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, suitable for industrial applications.
• Compact QSOP Package: Measures 4.9mm (L) × 6.02mm (D) × 1.47mm (H), ideal for space-constrained designs.
• BUS Circuit Designator: Optimized for bus termination, pull-up/pull-down networks, and voltage division.

GQ8B0169R8FFT Applications

This resistor network excels in:

• Analog/Digital Signal Conditioning: Precision voltage dividers in ADCs/DACs.
• Bus Termination Networks: For high-speed data lines (e.g., DDR, PCIe).
• Industrial Control Systems: Where thermal stability and long-term reliability are paramount.
• Medical Electronics: Low-noise signal paths in diagnostic equipment.
• Automotive (Non-Automotive Grade): Secondary circuits requiring tight tolerance (note: not PPAP-compliant).

Conclusion of GQ8B0169R8FFT

The GQ8B0169R8FFT stands out for its precision, compact form factor, and ceramic-enhanced durability, making it a superior choice for high-reliability electronics. While not automotive-grade, its thin-film technology and BUS configuration make it ideal for signal integrity-critical applications. Engineers will appreciate its balance of performance, size, and thermal resilience in advanced PCB layouts.