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GQ8B0173R2FT
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GQ8B0173R2FT Description
GQ8B0173R2FT Description
The GQ8B0173R2FT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding circuit applications. This 16-pin QSOP device integrates 15 resistors with a 73.2 Ω resistance value, offering 1% tolerance and a ±100 ppm/°C temperature coefficient for stable performance across a 70°C to 125°C operating range. Encased in a ceramic package, it ensures durability and thermal stability, with a 0.75W (3/4W) total power rating (0.05W per resistor). Its gull-wing termination and surface-mount design facilitate compact PCB integration, while the 100V maximum voltage rating suits medium-voltage applications.
GQ8B0173R2FT Features
- Precision Thin Film Technology: Delivers low noise and high accuracy (±1%) for signal conditioning and analog circuits.
- Robust Ceramic Case: Enhances thermal dissipation and mechanical strength in harsh environments.
- Space-Efficient QSOP Package: Measures 4.9mm (L) × 6.02mm (D) × 1.47mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
- BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down networks.
- Wide Temperature Range: Operates reliably from -55°C to 125°C (derated power up to 125°C).
- Non-Automotive, Non-PPAP: Ideal for industrial and commercial electronics where PPAP compliance isn’t required.
GQ8B0173R2FT Applications
This resistor network excels in:
- Analog/Digital Signal Processing: Precision voltage dividers, DAC/ADC interfaces.
- Bus Termination: DDR memory, CAN bus, and other high-speed data lines.
- Embedded Systems: Pull-up/down networks in microcontrollers and FPGAs.
- Test & Measurement Equipment: Stable reference circuits due to low TCR (±100 ppm/°C).
- Power Management: Feedback networks in DC-DC converters.
Conclusion of GQ8B0173R2FT
The GQ8B0173R2FT combines precision, compactness, and reliability, making it a standout choice for engineers designing high-density PCBs requiring stable resistance networks. Its ceramic construction, thin-film technology, and BUS-oriented design address challenges in signal integrity and thermal management, while the QSOP package ensures compatibility with automated assembly processes. Though not RoHS-compliant, it remains a robust solution for industrial and telecom applications where environmental regulations permit.



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