TT Electronics/IRC

GQ8B0180R6FT

GQ8B0180R6FT Description

The GQ8B0180R6FT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a 80.6Ω resistance value, offering 1% tolerance and a ±100ppm/°C temperature coefficient. Encased in a ceramic package, it ensures superior thermal stability and durability. The network operates within a wide temperature range of 70°C to 125°C and delivers a total power rating of 0.75W (3/4W), with 0.05W (1/20W) per resistor. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the 100V maximum voltage rating makes it suitable for robust circuit designs.

GQ8B0180R6FT Features

• Precision Thin Film Technology: Ensures low noise and high stability.
• Ceramic Case: Enhances thermal performance and mechanical strength.
• Compact QSOP Package: Saves board space with 4.9mm length, 6.02mm depth, and 1.47mm height.
• High Power Density: 0.75W total dissipation in a small footprint.
• Wide Operating Range: Reliable performance from 70°C to 125°C.
• Gull-Wing Termination: Optimized for automated SMD assembly.
• BUS Circuit Designator: Ideal for bus line termination and pull-up/down applications.

GQ8B0180R6FT Applications

This resistor network excels in:

• Analog/Digital Signal Conditioning: Precision voltage division and filtering.
• Bus Termination: Effective impedance matching in high-speed data lines (e.g., PCI, DDR).
• Industrial Electronics: Robust performance in harsh environments.
• Medical Devices: Stable operation in sensitive instrumentation.
• Automotive (Non-Automotive Grade): Auxiliary circuits where PPAP compliance isn’t required.

Conclusion of GQ8B0180R6FT

The GQ8B0180R6FT stands out for its precision, compactness, and reliability, making it a top choice for engineers needing high-density resistor networks. Its ceramic construction and thin-film technology ensure longevity, while the QSOP package aligns with modern miniaturization trends. Though not RoHS-compliant, it remains a robust solution for industrial, medical, and communication systems demanding tight tolerances and thermal resilience.