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GQ8B021130GDT
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GQ8B021130GDT Description
GQ8B021130GDT Description
The GQ8B021130GDT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a 113 Ω resistance value, offering a tight 2% tolerance and a low ±50 ppm/°C temperature coefficient. Encased in a robust ceramic package, it ensures reliability in demanding environments. With a 0.75W (3/4W) total power rating (0.05W per resistor) and a 100V maximum voltage rating, it operates efficiently across a wide temperature range of 70°C to 125°C. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.
GQ8B021130GDT Features
- Precision Thin Film Technology: Delivers stable performance with low noise and high accuracy.
- Ceramic Case Style: Enhances thermal stability and durability in harsh conditions.
- High Power Density: 0.75W total power (0.05W per resistor) in a compact 4.9mm x 6.02mm x 1.47mm footprint.
- Wide Operating Range: Suitable for -55°C to +125°C (derated power up to 125°C).
- BUS Circuit Designator: Optimized for bus termination and signal conditioning.
- QSOP Package: Space-saving 0.64mm terminal pitch for high-density PCB layouts.
- Non-Automotive, Non-PPAP: Ideal for industrial and commercial applications.
GQ8B021130GDT Applications
This resistor network excels in:
- Signal Conditioning: Precision voltage division and impedance matching in analog circuits.
- Bus Termination: Effective termination for data buses in communication systems.
- Industrial Electronics: Robust performance in PLC, instrumentation, and control systems.
- Medical Devices: Reliable operation in diagnostic and monitoring equipment.
- Test & Measurement: High-accuracy requirements in lab and field testing tools.
Conclusion of GQ8B021130GDT
The GQ8B021130GDT stands out for its precision, compact design, and rugged ceramic construction, making it a superior choice for applications demanding stable resistance, high power handling, and thermal resilience. While not automotive-grade, its thin-film technology and BUS optimization make it ideal for industrial, medical, and communication systems where reliability and accuracy are critical. Its QSOP gull-wing package ensures seamless integration into modern SMD assemblies, offering a balance of performance and space efficiency.



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