TT Electronics/IRC

GQ8B021620GBT

GQ8B021620GBT Description

The GQ8B021620GBT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a 162Ω resistance value, offering a tight 2% tolerance and a low ±50ppm/°C temperature coefficient. Encased in a ceramic package, it ensures excellent thermal stability and durability. With a 0.75W (3/4W) total power rating (0.05W per resistor) and a 100V maximum voltage rating, it operates reliably across a wide temperature range of 70°C to 125°C. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GQ8B021620GBT Features

• Precision Thin Film Technology: Delivers stable performance with low noise and high accuracy.
• Robust Ceramic Case: Enhances thermal conductivity and mechanical strength.
• High Power Density: 0.75W total power (0.05W per resistor) in a compact 4.9mm × 6.02mm × 1.47mm footprint.
• Wide Operating Range: Suitable for harsh environments (-55°C to +125°C).
• Automated Assembly Friendly: Gull-wing leads and 0.64mm pitch enable high-speed SMT processes.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation applications.

GQ8B021620GBT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces.
• Signal Conditioning: ADC/DAC reference networks, filter circuits.
• Industrial Control Systems: PLCs, motor drives, and power management.
• Telecommunications: RF modules and signal attenuation.
• Test & Measurement Equipment: Calibration and reference standards.

Conclusion of GQ8B021620GBT

The GQ8B021620GBT stands out for its combination of precision, power efficiency, and compact design, making it a superior choice for high-reliability applications. Its ceramic construction and thin-film technology ensure long-term stability, while the QSOP package optimizes board space. Though not RoHS-compliant, it remains a robust solution for industrial and telecom systems demanding tight tolerance and thermal resilience. Engineers will appreciate its balance of performance and manufacturability in demanding electronic designs.