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GQ8B021690GBT
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GQ8B021690GBT Description
GQ8B021690GBT Description
The GQ8B021690GBT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding applications requiring stable performance and tight tolerances. This 16-pin QSOP (Quarter-Small Outline Package) device integrates 15 resistors with a 169Ω resistance value, offering a 2% tolerance and a ±50ppm/°C temperature coefficient. Encased in a ceramic package, it ensures excellent thermal stability and durability, with a maximum operating temperature of 125°C. The gull-wing termination facilitates reliable surface-mount (SMD) assembly, while the 0.64mm terminal pitch supports high-density PCB layouts. With a total power rating of 0.75W (3/4W) and 0.05W per resistor, it balances power dissipation and compactness.
GQ8B021690GBT Features
- High Precision: Thin-film technology ensures low noise and stable performance over temperature fluctuations (±50ppm/°C).
- Robust Construction: Ceramic case enhances thermal conductivity and mechanical strength.
- Space-Efficient: QSOP package (4.9mm x 6.02mm x 1.47mm) optimizes board space without compromising power handling.
- Wide Voltage Range: Supports up to 100V, suitable for industrial and instrumentation circuits.
- Automated Assembly Friendly: Gull-wing leads and tight dimensional tolerances (±0.1mm height, ±0.2mm depth) ensure compatibility with pick-and-place systems.
- Non-Automotive: Ideal for commercial and industrial applications where PPAP compliance is not required.
GQ8B021690GBT Applications
This resistor network excels in:
- Analog Signal Conditioning: Precision voltage dividers in data acquisition systems.
- Medical Electronics: Stable reference circuits in diagnostic equipment.
- Test & Measurement: Calibration networks requiring low drift.
- Industrial Controls: Feedback loops in motor drives or power supplies.
- Communications: Impedance matching in RF modules.
Conclusion of GQ8B021690GBT
The GQ8B021690GBT stands out for its combination of precision, power efficiency, and compact design, making it a superior choice for applications demanding reliability in harsh environments. Its ceramic encapsulation and thin-film technology provide long-term stability, while the QSOP package ensures compatibility with modern SMD processes. Though not RoHS-compliant, it remains a robust solution for non-consumer electronics where performance outweighs regulatory constraints. Engineers will appreciate its balance of electrical and mechanical robustness in critical circuits.



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