TT Electronics/IRC

GQ8B021690GT

GQ8B021690GT Description

The GQ8B021690GT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a 169Ω resistance value, offering a tight 2% tolerance and a low ±50ppm/°C temperature coefficient. Encased in a ceramic package, it ensures superior thermal stability and reliability in harsh environments. With a 0.75W (3/4W) total power rating (0.05W per resistor) and a 100V maximum voltage rating, it is engineered for surface-mount (SMD) applications, featuring gull-wing terminations for secure PCB attachment. The compact dimensions (4.9mm x 6.02mm x 1.47mm) and 0.64mm terminal pitch make it ideal for space-constrained designs.

GQ8B021690GT Features

• High Precision: Thin-film technology ensures low tolerance (2%) and stable performance (±50ppm/°C).
• Robust Construction: Ceramic case enhances thermal dissipation and mechanical durability.
• Space-Efficient: QSOP package with 16 gull-wing terminals optimizes PCB real estate.
• Wide Operating Range: Functions reliably from -55°C to +125°C (derated power up to 125°C).
• Automated Assembly Friendly: Tube packaging simplifies pick-and-place processes.
• High Voltage Handling: Supports 100V maximum rating, suitable for industrial and telecom applications.

GQ8B021690GT Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers and pull-up/pull-down networks in data acquisition systems.
• Industrial Controls: PLC modules, motor drivers, and power management circuits requiring stable resistance.
• Telecommunications: RF front-end circuits and impedance matching networks.
• Medical Electronics: Patient monitoring devices where accuracy and reliability are critical.
• Automotive (Non-Automotive Rated): Sensor interfaces and dashboard electronics (note: not PPAP/automotive certified).

Conclusion of GQ8B021690GT

The GQ8B021690GT stands out for its precision, compactness, and ceramic-enhanced durability, making it a top choice for engineers prioritizing performance in high-density, high-reliability designs. While not suited for automotive-grade applications, its thin-film technology and robust specs cater to industrial, medical, and telecom sectors where stable resistance and thermal resilience are paramount. Its QSOP form factor further ensures compatibility with modern SMD assembly workflows.