TT Electronics/IRC

GQ8B021870FDT

GQ8B021870FDT Description

The GQ8B021870FDT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin QSOP device integrates 15 resistors with a uniform 187Ω resistance, offering 1% tolerance and a ±50ppm/°C temperature coefficient for stable performance across a -70°C to +125°C range. Encased in a ceramic package, it delivers 0.75W (3/4W) total power dissipation (0.05W per resistor) and supports 100V maximum voltage, making it suitable for high-density circuits requiring reliability under thermal stress. Its gull-wing termination and 0.64mm pitch ensure compatibility with automated PCB assembly.

GQ8B021870FDT Features

• Precision Thin Film Technology: Ensures low noise and high stability for sensitive analog/digital circuits.
• Compact Ceramic QSOP Package: 4.9mm × 6.02mm × 1.47mm dimensions with tight tolerances (±0.1mm height/length) save board space.
• High Power Density: 0.75W total rating (15 resistors) outperforms similar networks in power handling.
• Wide Temperature Range: Operates derated up to 125°C, ideal for industrial or automotive-adjacent environments (though not PPAP/automotive-certified).
• BUS Configuration: Simplifies PCB layout for bus termination, voltage division, or pull-up/down networks.

GQ8B021870FDT Applications

• Signal Conditioning: Precision dividers in ADC/DAC circuits or sensor interfaces.
• Bus Termination: Matched impedance for high-speed data lines (e.g., SPI, I²C).
• Power Management: Voltage scaling in DC-DC converters or load-sharing circuits.
• Industrial Controls: Robust performance in PLCs, motor drives, or instrumentation.
• Medical Electronics: Reliable operation in diagnostic equipment due to low TCR and thin-film stability.

Conclusion of GQ8B021870FDT

The GQ8B021870FDT combines high precision, thermal resilience, and compact design, addressing challenges in space-constrained, high-reliability applications. While not RoHS-compliant or automotive-grade, its ceramic construction and thin-film technology make it a superior choice for industrial, telecom, and medical designs requiring tight tolerance networks. Engineers benefit from its balanced power-to-size ratio and ease of integration in automated assembly processes.