TT Electronics/IRC

GQ8B021960FDT

GQ8B021960FDT Description

The GQ8B021960FDT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a 196Ω resistance value, offering 1% tolerance and a ±50ppm/°C temperature coefficient for stable performance across a -70°C to +125°C operating range. Encased in a ceramic substrate, it delivers 0.05W (1/20W) power dissipation per resistor and a total power rating of 0.75W (3/4W), making it suitable for compact, high-density circuits. The gull-wing termination ensures reliable solder joints, while the 100V maximum voltage rating enhances durability in industrial environments. Packaged in a tube, this non-automotive, non-PPAP compliant component is ideal for prototyping and production runs.

GQ8B021960FDT Features

• Precision Thin Film Technology: Ensures low noise and high stability (±50ppm/°C).
• Compact QSOP Package: 4.9mm (L) × 6.02mm (D) × 1.47mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• High Power Density: 0.75W total power in a miniature footprint.
• Wide Temperature Range: Operates from -70°C to +125°C with derated performance.
• BUS Circuit Designator: Simplifies PCB layout for bus termination or pull-up/down networks.
• Non-RoHS Compliant: Suitable for legacy or specialized applications requiring leaded materials.

GQ8B021960FDT Applications

• Signal Conditioning: Precision voltage dividers in data acquisition systems.
• Bus Termination: DDR memory interfaces or high-speed digital lines.
• Industrial Controls: Robust performance in PLCs, motor drives, and power supplies.
• Medical Electronics: Stable resistance in diagnostic equipment where thermal drift is critical.
• Aerospace & Defense: Reliable operation in harsh environments due to ceramic construction.

Conclusion of GQ8B021960FDT

The GQ8B021960FDT excels in applications requiring high precision, compact size, and thermal resilience. Its thin-film technology, ceramic case, and gull-wing terminals provide superior reliability over thick-film alternatives, while the QSOP package saves board space. Though not RoHS-compliant, it remains a top choice for legacy or high-reliability designs. Engineers will appreciate its balanced trade-offs between power handling, tolerance, and temperature stability, making it a versatile solution for analog and mixed-signal circuits.