TT Electronics/IRC

GQ8B023001CCT

GQ8B023001CCT Description

The GQ8B023001CCT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a 3K Ohm resistance value, offering a tight tolerance of ±0.25% and a low temperature coefficient of ±50ppm/°C. Encased in a ceramic package, it ensures superior thermal stability and durability. With a 0.75W (3/4W) total power rating and 0.05W (1/20W) per resistor, it operates reliably across a 70°C to 125°C derated temperature range, peaking at 125°C. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GQ8B023001CCT Features

• Precision Performance: 0.25% tolerance and ±50ppm/°C TCR ensure minimal drift in critical circuits.
• Robust Construction: Ceramic case enhances thermal dissipation and mechanical strength.
• High-Density Integration: 15 resistors in a compact 4.9mm × 6.02mm × 1.47mm QSOP package.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive-grade applications (though not PPAP/automotive-certified).
• Stable Power Handling: 0.75W total power with derating up to 125°C.
• Ease of Assembly: Gull-wing leads and 0.64mm pitch simplify automated SMD placement.

GQ8B023001CCT Applications

This resistor network excels in precision analog and digital circuits, including:

• Signal Conditioning: Voltage dividers, feedback networks in op-amps.
• Medical Electronics: High-accuracy sensor interfaces.
• Test & Measurement Equipment: Calibration circuits, reference voltage networks.
• Industrial Controls: PLCs, motor drivers requiring stable resistance under thermal stress.
• Communications: RF modules, impedance matching networks.

Conclusion of GQ8B023001CCT

The GQ8B023001CCT stands out for its precision, thermal resilience, and compact integration, making it ideal for applications demanding stable performance in harsh environments. While not automotive-compliant, its ceramic construction and thin-film technology offer superior reliability over polymer-based alternatives. Engineers will value its low TCR, high power density, and ease of mounting for space-constrained, high-performance designs.