TT Electronics/IRC

GQ8B023090GBT

GQ8B023090GBT Description

The GQ8B023090GBT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin QSOP (Quarter-Small Outline Package) device features 15 resistors with a 309Ω resistance value, offering a tight 2% tolerance and a low ±50ppm/°C temperature coefficient. Encased in a ceramic package, it ensures excellent thermal stability and reliability across a wide temperature range of 70°C to 125°C. With a 0.75W (3/4W) total power rating (0.05W per resistor) and a 100V maximum voltage rating, this surface-mount network is ideal for compact, high-density PCB designs.

GQ8B023090GBT Features

• Precision Thin-Film Technology: Delivers stable resistance values with minimal drift over temperature and time.
• Ceramic Case Style: Enhances thermal dissipation and mechanical robustness in harsh environments.
• Gull Wing Termination: Facilitates reliable surface-mount (SMD) assembly with a 0.64mm terminal pitch for high-density layouts.
• Compact QSOP Package: Measures just 4.9mm (L) × 6.02mm (D) × 1.47mm (H), making it suitable for space-constrained applications.
• BUS Circuit Designator: Optimized for bus line termination, voltage division, and pull-up/pull-down networks.
• Non-Automotive Grade: While not PPAP-capable, it excels in industrial, telecom, and instrumentation systems.

GQ8B023090GBT Applications

This resistor network is particularly suited for:

• Signal Conditioning: Precision voltage dividers and impedance matching in analog/digital interfaces.
• Bus Termination: Damping reflections in high-speed data lines (e.g., SPI, I²C).
• Embedded Systems: Pull-up/down networks in microcontrollers and FPGAs.
• Test & Measurement Equipment: Stable reference circuits due to low TCR and tight tolerance.
• Aerospace & Defense: Ceramic packaging ensures durability in thermally variable environments.

Conclusion of GQ8B023090GBT

The GQ8B023090GBT stands out for its combination of precision, power handling, and compact form factor. Its ceramic construction and thin-film technology provide superior performance over carbon or thick-film alternatives, particularly in high-frequency or thermally unstable environments. While not RoHS-compliant, it remains a robust choice for industrial and professional applications where reliability and accuracy are paramount. Engineers will appreciate its ease of integration and consistent performance in critical circuit functions.