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GQ8B024871GBT
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GQ8B024871GBT Description
GQ8B024871GBT Description
The GQ8B024871GBT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a uniform 4.87KΩ resistance value, offering a tight ±2% tolerance and a low ±50ppm/°C temperature coefficient. Encased in a ceramic substrate, it ensures superior thermal stability and durability in harsh environments. With a 0.75W (3/4W) total power rating (0.05W per resistor) and a 100V maximum voltage rating, it balances compactness with robust performance. The gull-wing termination facilitates reliable PCB mounting, while its ±0.1mm height tolerance and 4.9mm × 6.02mm footprint suit high-density layouts.
GQ8B024871GBT Features
- Precision Thin Film Technology: Delivers stable resistance with minimal drift over temperature (±50ppm/°C).
- Ceramic Case: Enhances thermal conductivity and mechanical strength, ideal for 70°C to 125°C derated operation.
- High Power Density: 0.75W total dissipation in a compact QSOP package, outperforming similar arrays in power-to-size ratio.
- Automated Assembly Friendly: Gull-wing leads and 0.64mm terminal pitch streamline SMD placement.
- Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use where EU RoHS compliance is not critical.
GQ8B024871GBT Applications
- Signal Conditioning Circuits: Precision voltage dividers in data acquisition systems.
- Medical Equipment: Stable biasing networks in diagnostic devices.
- Test & Measurement: Calibration resistors for high-accuracy instruments.
- Telecom Infrastructure: Impedance matching in RF modules.
- Industrial Controls: Robust networks for PLCs and sensor interfaces.
Conclusion of GQ8B024871GBT
The GQ8B024871GBT excels in applications requiring compactness, precision, and thermal resilience. Its ceramic construction, thin-film accuracy, and high power handling make it a standout choice for engineers designing reliable, space-constrained electronics. While not suited for automotive use, it is a cost-effective solution for industrial and telecom systems where consistent performance under thermal stress is paramount.



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