TT Electronics/IRC

GQ8B0252R3FDT

GQ8B0252R3FDT Description

The GQ8B0252R3FDT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin QSOP package integrates 15 resistors with a 52.3Ω resistance value, offering 1% tolerance and a ±50ppm/°C temperature coefficient for stable performance across a -70°C to +125°C operating range. The ceramic case ensures durability, while the gull-wing termination facilitates reliable PCB mounting. With a total power rating of 0.75W (3/4W) and 100V maximum voltage rating, this network is engineered for precision analog and digital circuits requiring tight tolerances and low drift.

GQ8B0252R3FDT Features

• High Accuracy: 1% tolerance and ±50ppm/°C TCR ensure consistent performance in temperature-variable environments.
• Robust Construction: Ceramic substrate and thin-film technology provide excellent thermal stability and long-term reliability.
• Space-Efficient Design: Compact QSOP package (4.9mm x 6.02mm x 1.47mm) optimizes board space in high-density layouts.
• Power Handling: 0.05W per resistor (0.75W total) supports moderate power dissipation needs.
• Automated Assembly Friendly: Gull-wing leads and 0.64mm pitch enable seamless SMD placement.
• Non-Automotive: Suitable for industrial and commercial applications where PPAP compliance is not required.

GQ8B0252R3FDT Applications

• Signal Conditioning: Ideal for voltage dividers, pull-up/pull-down networks, and impedance matching in precision analog circuits.
• Medical Electronics: Stable performance suits patient monitoring equipment and diagnostic devices.
• Test & Measurement: Low drift and high accuracy make it valuable in calibration instruments and data acquisition systems.
• Communication Systems: Used in RF modules and baseband processing where consistent resistance values are critical.
• Industrial Controls: Reliable operation in PLCs, motor drives, and sensor interfaces.

Conclusion of GQ8B0252R3FDT

The GQ8B0252R3FDT resistor network combines precision, compactness, and robustness, making it a superior choice for applications demanding tight tolerances and thermal stability. Its ceramic construction, thin-film technology, and QSOP packaging offer a competitive edge over bulkier or less stable alternatives. While not PPAP-compliant, it excels in industrial, medical, and communication systems where accuracy and reliability are paramount. Engineers seeking a high-performance, space-saving solution for analog or mixed-signal designs will find this component indispensable.