TT Electronics/IRC

GQ8B0261R9GFT

GQ8B0261R9GFT Description

The GQ8B0261R9GFT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin QSOP package integrates 15 resistors with a 61.9Ω resistance value and a tight 2% tolerance, ensuring consistent performance in demanding circuits. The ceramic case and thin-film technology provide excellent stability, with a low ±50ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. Rated for 0.75W (3/4W) total power and 0.05W (1/20W) per resistor, it supports 100V maximum voltage and operates reliably from 70°C to 125°C. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GQ8B0261R9GFT Features

• Precision Network: 15 resistors in a single QSOP-16 package, reducing board space and assembly complexity.
• Stable Performance: ±50ppm/°C TCR and 2% tolerance ensure accuracy over temperature variations.
• Robust Construction: Ceramic substrate enhances thermal and mechanical durability.
• High Power Handling: 0.75W total dissipation (0.05W per resistor) suits power-sensitive designs.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and automotive applications (though not PPAP-certified).
• Surface-Mount Ready: Gull-wing leads and 0.64mm pitch for reliable SMD soldering.

GQ8B0261R9GFT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and feedback networks in op-amp circuits.
• Industrial Control Systems: Stable resistance in PLCs, sensors, and motor drives.
• Communication Equipment: Impedance matching and termination in RF/high-speed PCBs.
• Test & Measurement: Calibration circuits requiring low drift and high accuracy.
• Power Management: Current sensing and load balancing in DC-DC converters.

Conclusion of GQ8B0261R9GFT

The GQ8B0261R9GFT combines high density, precision, and reliability in a compact QSOP-16 package. Its thin-film technology, low TCR, and robust ceramic construction make it superior to thicker-film or carbon-based alternatives. While not automotive-grade, it is well-suited for industrial, telecom, and instrumentation applications where space efficiency and thermal stability are critical. The tube packaging ensures safe handling during assembly, further enhancing its appeal for high-volume manufacturing.