TT Electronics/IRC

GQ8B028870FBT

GQ8B028870FBT Description

The GQ8B028870FBT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors with a 887Ω resistance value, offering 1% tolerance and a ±50ppm/°C temperature coefficient. Encased in a ceramic package, it delivers 0.75W (3/4W) total power rating (0.05W per resistor) and operates across a wide temperature range of 70°C to 125°C. Its gull-wing termination and surface-mount design ensure reliable PCB integration, while the 100V maximum voltage rating makes it suitable for low-to-medium voltage circuits.

GQ8B028870FBT Features

• Precision Performance: Thin-film technology ensures low noise, high stability, and tight tolerance (1%), ideal for signal conditioning and analog circuits.
• Robust Construction: Ceramic case provides excellent thermal conductivity and mechanical durability, outperforming plastic-encased alternatives.
• Space-Efficient: Compact QSOP package (4.9mm × 6.02mm × 1.47mm) with 0.64mm terminal pitch maximizes board space utilization.
• Wide Operating Range: Functions reliably from 70°C to 125°C, making it suitable for industrial and automotive-adjacent environments (though not PPAP/Automotive certified).
• High Power Density: 0.75W total dissipation (15 resistors) balances performance and thermal management in dense layouts.

GQ8B028870FBT Applications

• Signal Processing: Precision voltage dividers, DAC/ADC interfaces, and feedback networks in test/measurement equipment.
• Industrial Controls: PLCs, sensor arrays, and power management circuits requiring stable resistance under thermal stress.
• Communications: RF matching networks and filter circuits where low TCR (±50ppm/°C) minimizes drift.
• Medical Electronics: Diagnostic devices and portable monitors benefiting from the ceramic package’s reliability.

Conclusion of GQ8B028870FBT

The GQ8B028870FBT excels in applications demanding precision, compactness, and thermal resilience. Its ceramic QSOP package, thin-film technology, and 1% tolerance provide a competitive edge over polymer-based networks, particularly in harsh environments. While not automotive-grade, its 125°C rating and robust construction make it a versatile choice for industrial, medical, and communication systems. Engineers will appreciate its balance of power handling, density, and stability in space-constrained designs.