TT Electronics/IRC

GQCB011331FBT

GQCB011331FBT Description

The GQCB011331FBT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features a 1.33K Ohm resistance value per resistor with a tight 1% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for demanding circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the rectangular ceramic case ensures durability and thermal stability.

GQCB011331FBT Features

• Precision Thin Film Technology: Delivers high accuracy (±1%) and low TCR (±100ppm/°C) for stable operation.
• Robust Ceramic Package: Enhances thermal management and mechanical strength in harsh environments.
• High-Density Integration: 23 resistors in a compact QSOP-24 (8.66mm x 6.02mm x 1.47mm) footprint, ideal for space-constrained designs.
• Wide Operating Range: Rated for 125°C maximum temperature and derated power up to 125°C.
• Automated Assembly-Friendly: Gull-wing leads and 0.64mm terminal pitch streamline SMD processes.
• Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use.

GQCB011331FBT Applications

This resistor network excels in:

• Signal Conditioning Circuits: Precision voltage dividers and pull-up/down networks in ADCs/DACs.
• Industrial Control Systems: Stable resistance in PLCs, motor drives, and power supplies.
• Telecommunications Equipment: Impedance matching and termination in high-frequency PCBs.
• Test & Measurement Devices: Calibration circuits requiring low drift over temperature.
• Medical Electronics: Reliable performance in diagnostic equipment where consistency is critical.

Conclusion of GQCB011331FBT

The GQCB011331FBT stands out for its precision, compactness, and rugged ceramic construction, making it a superior choice for applications demanding tight tolerance and thermal stability. While not RoHS-compliant, its thin-film technology and high-density integration offer a competitive edge in industrial and telecom markets. Engineers will appreciate its balance of performance, reliability, and ease of assembly in advanced electronic systems.