TT Electronics/IRC

GQCB011471GGT

GQCB011471GGT Description

The GQCB011471GGT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features a 1.47KΩ resistance value per resistor with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for demanding circuit designs. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the rectangular ceramic case ensures durability and thermal stability.

GQCB011471GGT Features

• Precision Thin Film Technology: Delivers high accuracy (±2%) and low TCR (±100ppm/°C) for stable operation.
• Robust Ceramic Package: Enhances thermal management and mechanical strength in harsh environments.
• High-Density Integration: 23 resistors in a compact QSOP-24 (8.66mm x 6.02mm x 1.47mm) footprint.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
• Automated Assembly-Friendly: Gull-wing leads and 0.64mm pitch simplify SMT processes.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation applications.

GQCB011471GGT Applications

This resistor network excels in:

• Voltage Division & Bus Termination: The BUS circuit designator ensures reliable signal integrity in digital systems.
• Precision Analog Circuits: Suitable for op-amp feedback networks and sensor interfaces due to low TCR.
• High-Temperature Environments: Ceramic construction suits power supplies and industrial controls.
• Space-Constrained PCBs: Compact QSOP package optimizes board real estate in embedded systems.

Conclusion of GQCB011471GGT

The GQCB011471GGT combines precision, durability, and high-density integration, making it a superior choice for engineers needing reliable resistor networks in industrial, communication, and test equipment. Its ceramic thin-film design outperforms standard thick-film arrays in stability and power handling, while the QSOP package ensures compatibility with modern SMT workflows. For applications demanding tight tolerances and thermal resilience, this model stands out in its category.