TT Electronics/IRC

GQCB012701GFT

GQCB012701GFT Description

The GQCB012701GFT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features a 2.7KΩ resistance value per resistor with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for demanding circuit designs. The gull-wing termination and surface-mount (SMD) design facilitate easy PCB integration, while the rectangular ceramic case ensures durability and thermal stability.

GQCB012701GFT Features

• High-Density Integration: 23 resistors in a compact QSOP package (8.66mm x 6.02mm x 1.47mm) save board space.
• Precision Performance: ±100ppm/°C TCR and 2% tolerance ensure accuracy in sensitive analog/digital circuits.
• Robust Construction: Ceramic substrate enhances thermal management and reliability in harsh environments.
• Wide Operating Range: Rated for -55°C to +125°C, derated up to 125°C for high-temperature applications.
• Automation-Friendly: Gull-wing leads and 0.64mm terminal pitch simplify pick-and-place assembly.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation uses where automotive compliance isn’t required.

GQCB012701GFT Applications

• Signal Conditioning: Precision voltage dividers and pull-up/pull-down networks in data acquisition systems.
• Analog Circuits: Feedback networks in op-amps, ADCs, and DACs due to low TCR and tight tolerance.
• Power Management: Load sharing and current sensing in DC-DC converters and power supplies.
• Communications: Impedance matching and termination in high-speed digital interfaces (e.g., LVDS).
• Industrial Controls: Durable performance in PLC modules and sensor interfaces where temperature fluctuations occur.

Conclusion of GQCB012701GFT

The GQCB012701GFT excels in space-constrained, precision applications requiring stable resistance values under thermal stress. Its thin-film technology, ceramic encapsulation, and high pin-count integration make it superior to thicker-film or polymer-based networks. While not RoHS-compliant, it remains a top choice for industrial and telecom designs demanding reliability and accuracy. Engineers will appreciate its balance of performance, density, and ease of assembly, particularly in mixed-signal PCBs and power electronics.