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GQCB012872FFT
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GQCB012872FFT Description
GQCB012872FFT Description
The GQCB012872FFT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features a 28.7KΩ resistance value per resistor with a tight 1% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a maximum voltage rating of 100V, making it suitable for demanding circuit designs. The gull-wing termination and surface-mount (SMD) design facilitate easy PCB integration, while the rectangular ceramic case ensures durability and thermal stability.
GQCB012872FFT Features
- Precision Thin Film Technology: Delivers high accuracy (±1%) and low TCR (±100ppm/°C) for stable operation in varying temperatures.
- Robust Ceramic Package: Enhances thermal dissipation and mechanical strength, ideal for harsh environments.
- High-Density Integration: 23 resistors in a compact QSOP-24 package (8.66mm × 6.02mm × 1.47mm) save board space.
- Wide Operating Range: Rated for 125°C maximum temperature and derated power up to 125°C.
- Automated Assembly Friendly: Gull-wing leads and 0.64mm terminal pitch simplify SMD placement.
- Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation applications.
GQCB012872FFT Applications
- Signal Conditioning Circuits: Precision voltage dividers and feedback networks in analog systems.
- Medical Equipment: High-reliability sensor interfaces and diagnostic devices.
- Telecom Infrastructure: Line termination and impedance matching in high-frequency modules.
- Industrial Control Systems: Durable resistor networks for PLCs and motor drivers.
- Test & Measurement: Calibration circuits requiring low drift and long-term stability.
Conclusion of GQCB012872FFT
The GQCB012872FFT stands out for its precision, compactness, and rugged ceramic construction, making it a superior choice for applications demanding tight tolerances and thermal resilience. While not PPAP-compliant, its thin-film technology and high power density cater to advanced electronics in industrial and communication sectors. Engineers will appreciate its balance of performance, reliability, and space-saving design in complex PCB layouts.



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