TT Electronics/IRC

GQCB013161GBT

GQCB013161GBT Description

The GQCB013161GBT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features a 3.16KΩ resistance value with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for demanding circuit designs. The gull-wing termination and surface-mount (SMD) design facilitate easy PCB integration, while its compact dimensions (8.66mm x 6.02mm x 1.47mm) save board space.

GQCB013161GBT Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
• Ceramic QSOP Package: Enhances thermal performance and durability in harsh environments.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power handling.
• High Power Density: 1W total dissipation (0.05W per resistor) in a miniaturized footprint.
• Automated Assembly Friendly: Gull-wing leads and 0.64mm pitch ensure compatibility with pick-and-place systems.

GQCB013161GBT Applications

Ideal for:

• Bus Termination Networks: Ensures signal integrity in high-speed digital systems (e.g., memory interfaces, FPGAs).
• Voltage Dividers: Precision attenuation in sensor interfaces or ADC/DAC circuits.
• Industrial Controls: Stable performance in PLCs, motor drives, and power supplies.
• Medical Electronics: Reliable operation in diagnostic equipment due to low TCR and high accuracy.
• Aerospace & Defense: Ceramic casing withstands thermal stress in avionics or communication systems.

Conclusion of GQCB013161GBT

The GQCB013161GBT stands out for its precision, power efficiency, and robust ceramic construction, making it a superior choice for engineers requiring reliable resistor networks in compact, high-reliability designs. Its 2% tolerance, low TCR, and BUS-optimized layout address critical needs in industrial, medical, and high-speed digital applications, while the QSOP package ensures compatibility with modern SMD assembly processes. For projects demanding thermal resilience and electrical stability, this model offers a compelling balance of performance and miniaturization.