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GQCB013300FCT
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GQCB013300FCT Description
GQCB013300FCT Description
The GQCB013300FCT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features a 330Ω resistance value with a tight 1% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Encased in a ceramic QSOP package, it offers 1W total power dissipation (0.05W per resistor) and a maximum voltage rating of 100V. The 24-pin gull-wing SMD termination ensures reliable surface-mount compatibility, while its compact 8.66mm × 6.02mm × 1.47mm footprint suits space-constrained designs.
GQCB013300FCT Features
- Precision Thin Film Technology: Delivers high accuracy (±1%) and low TCR (±100ppm/°C) for stable operation in varying environments.
- Robust Ceramic Package: Enhances thermal performance and durability, ideal for harsh conditions.
- High Power Handling: 1W total power rating (1/20W per resistor) supports demanding circuits.
- BUS Circuit Designator: Optimized for bus line termination, reducing signal reflection in high-speed applications.
- QSOP Gull-Wing Termination: Ensures secure PCB mounting with a 0.64mm pitch for high-density layouts.
- Wide Temperature Range: Operates reliably from 70°C to 125°C, derated for extended thermal performance.
GQCB013300FCT Applications
This resistor network excels in:
- Bus Line Termination: Minimizes signal integrity issues in digital communication systems (e.g., CAN, I2C, SPI).
- Precision Analog Circuits: Suitable for ADC/DAC reference networks, voltage dividers, and sensor interfaces.
- Industrial Electronics: Robust ceramic construction withstands high-vibration and high-temperature environments.
- Automotive & Aerospace (non-PPAP): Ideal for non-safety-critical subsystems requiring stable resistance.
- Compact Consumer Electronics: Space-saving QSOP package fits wearables, IoT devices, and portable instrumentation.
Conclusion of GQCB013300FCT
The GQCB013300FCT combines precision, power efficiency, and compact design, making it a superior choice for high-reliability resistor networks. Its ceramic QSOP package, thin-film technology, and BUS optimization provide distinct advantages over standard arrays, particularly in signal integrity-critical and thermally challenging applications. While not PPAP-compliant, it remains a cost-effective solution for industrial, automotive (non-safety), and high-density electronic designs.



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