TT Electronics/IRC

GQCB013322FDT

GQCB013322FDT Description

The GQCB013322FDT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. It integrates 23 resistors in a compact 24-pin QSOP package with a ceramic case, offering a 33.2KΩ resistance per element at a tight 1% tolerance. Rated for 1W total power dissipation (0.05W per resistor), it operates across a wide temperature range of 70°C to 125°C with a low ±100ppm/°C temperature coefficient, ensuring stability under thermal stress. The gull-wing termination and surface-mount design facilitate automated assembly, while the 100V maximum voltage rating enhances reliability in high-voltage circuits.

GQCB013322FDT Features

• Precision Thin Film Technology: Delivers low noise and high accuracy (±1%) for signal conditioning and analog circuits.
• Robust Ceramic Package: Ensures mechanical durability and efficient heat dissipation in harsh environments.
• High-Density Integration: 23 resistors in a 6.02mm x 8.66mm footprint, ideal for space-constrained PCBs.
• Wide Operating Range: Stable performance from 70°C to 125°C with derated power handling.
• Automation-Friendly: Gull-wing leads and 0.64mm pitch comply with standard SMD placement equipment.
• Non-Automotive/Non-PPAP: Suitable for industrial and commercial applications where PPAP compliance is not required.

GQCB013322FDT Applications

This resistor network excels in:

• Precision Voltage Dividers: Critical in ADC/DAC reference circuits and sensor interfaces.
• Bus Termination Networks: Mitigates signal reflection in high-speed data lines (e.g., memory buses).
• Medical/Test Equipment: Demands stable resistance values under thermal cycling.
• Industrial Control Systems: Resilient to EMI and power fluctuations due to ceramic construction.
• Aerospace & Defense: Non-compliant with EU RoHS, making it suitable for exempted legacy systems.

Conclusion of GQCB013322FDT

The GQCB013322FDT stands out for its combination of precision, power handling, and compactness, tailored for engineers prioritizing reliability in analog and mixed-signal designs. While not suited for automotive use, its ceramic package and thin-film technology make it a robust choice for industrial, medical, and high-reliability applications. The QSOP gull-wing package ensures compatibility with modern SMT processes, offering a balance of performance and manufacturability.