TT Electronics/IRC

GQCB0133R0FFT

GQCB0133R0FFT Description

The GQCB0133R0FFT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 23-resistor array features a 33 Ohm resistance value with a tight 1% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a 24-pin QSOP ceramic package, it offers a 1W total power rating (0.05W per resistor) and a maximum voltage rating of 100V. Its gull-wing termination and surface-mount design make it ideal for automated assembly processes. The ceramic case provides excellent thermal stability, while the thin-film technology ensures high accuracy and reliability.

GQCB0133R0FFT Features

• Precision Thin Film Technology: Delivers high accuracy (±1%) and low TCR (±100ppm/°C).
• Robust Ceramic Package: Enhances thermal performance and mechanical durability.
• High-Density Integration: 23 resistors in a compact QSOP-24 package (8.66mm x 6.02mm x 1.47mm).
• Wide Operating Range: Suitable for -55°C to +125°C environments with derated power up to 125°C.
• Automation-Friendly: Gull-wing leads and 0.64mm terminal pitch simplify PCB assembly.
• Non-Automotive/Non-PPAP: Best suited for industrial and commercial applications.

GQCB0133R0FFT Applications

This resistor network excels in:

• Signal Conditioning Circuits: Precision voltage dividers and pull-up/down networks.
• Analog/Digital Systems: ADC/DAC reference networks, impedance matching.
• Test & Measurement Equipment: High-stability feedback networks.
• Industrial Control Systems: Where consistent resistance values under thermal stress are critical.
• Medical Electronics: Low-noise, high-reliability signal processing.

Conclusion of GQCB0133R0FFT

The GQCB0133R0FFT stands out for its precision, compactness, and thermal resilience, making it a superior choice for applications demanding tight tolerances and long-term stability. While not automotive-grade, its ceramic thin-film construction and QSOP packaging offer a compelling balance of performance and space efficiency for industrial and commercial designs. Engineers will appreciate its repeatability in automated assembly and consistent behavior under thermal stress, ensuring reliable operation in demanding environments.